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Low-Cost, High-Volume Production Test Solution for Next-Generation High-Speed DDR3-SDRAM Memory


TOKYO, Japan, April 2008 - Advantest Corporation (TSE: 6857, NYSE: ATE) today announced its new T5503 high-throughput memory test system, boasting the industryís highest parallel test capability of up to 128 devices. The T5503 was developed specifically to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM memory. The memory tester will be available from August 2008 and will also be on display at the ďAdvantest Tour de Force 2008Ē exhibition to be held at the Tokyo International Forum, June 3-5.

Adoption of Next-Generation DDR3-SDRAM Necessitates
Low-Cost Test Solution

As computers become more and more sophisticated, DRAM, used largely as the main memory storage in computers, is continually being replaced with new generations of products that have ever increasing capabilities. The race to achieve higher device speeds and multiple functionality is rapidly advancing in high-performance PCs as the demand for lifelike graphics with audiovisual equipment, including digital TVs and game consoles, continues to escalate. Consequently, these and other machines are driving a shift toward increased employment of very high-speed memory devices, such as DDR3-SDRAM.

Next-generation DDR3-SDRAM boasts low power consumption through a reduced operating voltage of 1.5V, compared to the DDR2-SDRAMís 1.8V, as well as higher speed and higher volume data processing. Because of these generational advantages, manufacturers are transitioning to DDR3-SDRAM, and it is predicted to be in high demand in a wide variety of fields, ranging from high-end desktop computers to notebook computers and digital consumer electronics. As a result, price competition between IC manufacturers is predicted to escalate, driving an increased demand for volume-production solutions that deliver lower overall cost-of-test.

The introduction of the T5503 reinforces Advantestís market leadership in delivering advanced technology solutions for its global customersí next-generation test requirements.

Features and Benefits

(1) Parallel test of up to 128 DDR3-SDRAM units
The T5503 enables package test of up to 128 DDR3-SDRAM devices simultaneously. This is double that of the companyís previous models, enabling a major reduction in test costs for high volume production lines. Furthermore, with maximum test speed of 3.2Gbps, it is the fastest in the industry for high-volume production testing, making the T5503 an ideal solution for high-volume production testing of DDR3-SDRAM with data transmission speeds of over 1Gbps, as well as for GDDR3 and GDDR4.
(2) Major space and energy savings
(40% reduction in floor area and 45% reduction in power consumption)
The testerís semiconductor circuitry makes full use of the latest CMOS technology to achieve greater packaging density, reducing the footprint by approximately 40% over the companyís previous model, and leading to space savings in high-volume production lines. Power consumption has also been reduced by approximately 45% compared to the systemís predecessor, enabling environmentally friendly operation.
(3) Equipped with Advantestís unique multi-strobe capabilities
Advantestís proprietary multi-strobe capabilities, introduced in the companyís previous model, the T5501, have been further enhanced in the T5503. Supporting source-synchronous test with the use of multi-strobe technology that measures the phase difference between data output from the device and the reference clock signal at each clock cycle, the system provides high-speed, high-precision test.

Key Specifications

Target Test Devices : DDR3-SDRAM, GDDR3, GDDR4 etc.
Parallel Test Capacity : Up to 128 units
Maximum Test Speed : 3.2Gbps

Further Enquiries

Enquiries about this product should be directed to:
Strategic Sales Division at 81-3-3214-7505

Note: All information supplied in this release is correct at the time of publication, but may be subject to change without warning.


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