Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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FDA Approves New Device for Treating Moderate to Severe Chronic Heart Failure in Patients: 3/22/2019 12:43:03 PM; The U.S. Food and Drug Administration approved the Optimizer Smart system for treating patients with chronic, moderate-to-severe heart failure who are not suited for treatment with other heart failure devices such as cardiac resynchronization therapy to restore a normal timing pattern of the heartbeat.
Samsung Develops Industry’s First 3rd-generation 10nm-Class DRAM for Premium Memory Applications: 3/22/2019 11:25:41 AM; Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry.
Matrox Unveils Matrox M264 S4: The World’s Only Four-Channel 4Kp60 XAVC Codec Card: 3/22/2019 10:54:14 AM; Matrox® Video announces the Matrox M264 S4, a new addition to the Matrox M264 family of H.264 hardware codec cards. The Matrox M264 S4 card supports up to four channels of 4K Sony® XAVC and Panasonic® AVC-ULTRA encoding/decoding in a single-slot card to enable high-density, multi-channel 4K workflows in PC-based platforms.
AGC Established a Global Tri-polar R&D Framework for Automotive On-glass Antennas: 3/19/2019 5:11:44 PM; AGC (Headquarters: Tokyo; President: Takuya Shimamura) announced that the anechoic chambers constructed in Gosselies (Belgium) for the development of automotive on-glass antennas were inaugurated on March 15, 2019.
FUJIFILM Dimatix to Showcase Innovative Inkjet Technologies at LOPEC 2019 in Germany: 3/19/2019 9:42:19 AM; FUJIFILM Dimatix, Inc. will demonstrate its piezoelectric inkjet technology and its high performance MEMS based drop-on-demand printheads at the upcoming LOPEC trade fair for printed electronics, March 20 – 21, 2019, in Munich, Germany.
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing: 3/15/2019 2:53:33 PM; EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories.
ZEISS Semiconductor Mask Solutions Receives Intel’s Preferred Quality Supplier Award: 3/15/2019 3:36:53 AM; ZEISS Semiconductor Mask Solutions has been recognized by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like ZEISS that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.
Colter & Peterson’s CutterMart Offers Value, Service, Peace-of-Mind and More: 3/6/2019 4:09:32 PM; While an auction website is a great place to buy everything from clothing to power tools, Colter & Peterson’s President and CEO assures buyers that it is no place to buy a heavy duty paper cutting system.
Hitachi Vantara Doubles Down on Partner Business, Drives Growth Across Robust Ecosystem: 3/6/2019 2:28:10 PM; Hitachi Vantara, a wholly owned subsidiary of Hitachi, Ltd. (TSE: 6501), today highlighted the investments and progress the company has made in its partner business that have netted the company and its partners significant growth over the last year.
Corning to Highlight Solutions at 2019 Optical Networking and Communication Conference: 3/6/2019 2:11:28 PM; Corning Incorporated (NYSE:GLW) will highlight innovations that help network operators stay ahead of demand for high-bandwidth capabilities at the 2019 Optical Networking and Communication Conference & Exhibition (OFC) March 5-7 in San Diego.
Western Digital and WekaIO Collaborate on NVMe Flash Platforms and Object Storage to Lower Infrastructure Cost in HPC and Machine Learning Environments: 3/6/2019 1:42:33 PM; WekaIO, the innovation leader in high-performance, scalable file storage for data-intensive applications, and Western Digital (NASDAQ: WDC) today announced that the companies are collaborating to deliver a fast scale-out architecture for data-centric high-performance computing (HPC) and machine learning (ML) applications.
Samsung Electronics Doubling Current Smartphone Storage Speed as it Begins Mass Production of First 512GB eUFS 3.0: 2/27/2019 11:39:27 AM; Samsung Electronics the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 for next-generation mobile devices.
Tinier and less power-hungry quantum atomic clock push toward intelligent IoT: 2/22/2019 1:03:28 PM; Scientists at Tokyo Institute of Technology, Ricoh co. and The National Institute of Advanced Industrial Science and Technology have developed an ultra-lowpower atomic clock (ULPAC) for small satellites to enable future communication systems beyond 5G.
DENSO Announces New Executive Structure and Management Changes: 2/22/2019 12:13:47 PM; DENSO Corporation today announced changes to its executive management structure and personnel. As the auto industry continues to evolve more rapidly than ever, these changes will help DENSO achieve its long-term vision to create and inspire new value for the future of mobility.