Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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Syrma Technology Receives Top Prize for Quality at 2016-17 ELCINA-EFY Group Awards: 9/15/2017 6:33:57 PM; Syrma Technology, a leader in electronic design and manufacturing services serving global OEMs, today received the First Prize for Quality in the SME category at the annual ELCINA-EFY Group Awards, at a gala presentation at The Lalit Hotel in New Delhi, India.
SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology: 9/15/2017 3:31:14 AM; SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the qualification of 10nm Ultra-high Density wafer bumping for Qualcomm Technologies.
Afero® Launches Next Generation IoT Development Kit in Partnership with Semiconductor Leader Microchip: 9/14/2017 12:23:16 PM; Afero, the next-generation IoT company with a fully integrated and highly secure edge-to-cloud platform, announced today the availability of the Afero Modulo-2™, an IoT development kit with secure connectivity, secure data, and a highly productive development environment.
Logic PD Appoints Jamie Jansen as Vice President of Sales: 9/13/2017 2:41:42 PM; Logic PD, an Electronics Manufacturing Services (EMS) and Product Development solutions company for the connected digital world, has named Jamie Jansen to the role of Vice President of Sales.
LG to Unveil Next Generation OLED Technology at Frankfurt Motor Show: 9/13/2017 6:42:42 AM; LG Electronics (LG) will introduce its advanced auto component technologies at the 2017 Frankfurt Motor Show (September 14-24), highlighted by the company’s first advanced OLED rear lamps to be featured in vehicles from a major European automaker.
EEMBC Benchmark Verifies Energy Cost of Integrated Microcontroller Peripherals: 9/12/2017 8:00:00 AM; EEMBC®, the industry-consortium setting the standard for valuable and practical embedded system benchmarks, today announced the availability of EEMBC ULPMark™-PeripheralProfile (ULPMark™-PP), a tool to measure the energy efficiency of microcontrollers (MCUs) and their commonly-used, programmable peripherals.
NETGEAR Expands Options In Affordable 10 Gigabit Switching Connectivity For Small And Medium Businesses: 9/6/2017 3:29:09 PM; NETGEAR®, Inc. (NASDAQ: NTGR) is introducing a powerful addition to its second-generation Smart Managed Switching product offering for small to medium-sized businesses (SMBs) — the NETGEAR 12-Port 10-Gigabit Ethernet Smart Managed Pro Switch (XS712Tv2).
DENSO to Exhibit at International Motor Show (IAA) in Frankfurt: 9/5/2017 9:09:14 AM; DENSO Corporation today announced that it will exhibit at the 67th IAA (Internationale Automobil-Ausstellung) Motor Show in Frankfurt, Germany, from September 14-24, 2017.
Next-generation radiation-hardened computer for space: 8/24/2017 9:27:39 AM; BAE Systems, a world leader in radiation-hardened computers and processors for satellites and spacecraft, announced a new generation of its flagship space computer that combines fast performance and extreme resiliency to enable previously impossible missions in the harsh environment of space.