Electronic Components
Releases published in the last 30 days. 
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- WACKER to present ceramifying silicone for optimizing thermal barrier performance at the Battery Show in Stuttgart
- 6/10/2026 9:02:44 AM
- • Silicone coating for flexible barrier systems protects battery components in the event of thermal runaway • WACKER also showcases newly formulated potting compounds for thermal management of power electronics WACKER will be presenting innovative solutions for battery electric vehicle (BEV) safety at the Battery Show in Stuttgart, Germany, from June 9 to June …
- HUAWEI Presents the Tau (τ) Scaling Law, Enabling Breakthroughs in Transistor Density and System Performance
- 5/25/2026 1:00:14 PM
- At the 2026 IEEE International Symposium on Circuits and Systems (ISCAS), He Tingbo from HUAWEI delivered a keynote speech titled “New Semiconductor Path in Practice”.
- Mitsubishi Electric to Ship Samples of NX-type 1.2kV IGBT Module for Industrial Use
- 5/19/2026 4:53:15 AM
- Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will begin shipping samples of ten new models of its industrial-use NX-type 1.2kV insulated gate bipolar transistor (IGBT) module on a sequential basis starting June 15.
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