Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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Samsung Brings On-device AI Processing for Premium Mobile Devices with Exynos 9 Series 9820 Processor: 11/15/2018 12:13:34 PM; Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest premium application processor (AP), the Exynos 9 Series 9820, equipped for on-device Artificial Intelligence (AI) applications.
AMD Holiday Gift Guide: “Just Add Wrapping” to AMD Ryzen™ processors, AMD Radeon™ graphics cards, and AMD-Powered Systems this Holiday: 11/12/2018 11:38:10 AM; Today, AMD (NASDAQ: AMD) kicked off its 2018 holiday campaign “Just Add Wrapping” to help consumers find perfect gifts this holiday season. With a variety of product offerings from AMD Ryzen desktop processors and AMD Radeon graphics cards, to AMD-powered notebook and desktop OEM systems, the AMD Holiday Buying Guide provides recommendations tailored for all PC users: …
Intel Accelerates Timing for Intel XMM 8160 5G Multimode Modem to Support Broad Global 5G Rollouts: 11/12/2018 11:28:12 AM; What’s New: Intel today announced the Intel® XMM™ 8160 5G modem, a multimode modem optimized to provide 5G connectivity to devices like phones, PCs and broadband access gateways.
Seagate And IBM Work Together To Help Reduce Global Hard Drive Counterfeiting With Blockchain Technology: 11/8/2018 12:03:24 PM; Seagate Technology plc (NASDAQ: STX), a world leader in data storage solutions, and IBM (NYSE: IBM) today announced they are working together to reduce product counterfeiting using blockchain and security technologies.
Fujitsu Receives EcoBalance 2018 "Award for Best Business Practices": 11/6/2018 2:13:51 PM; Fujitsu Limited and Fujitsu Laboratories Ltd. have received the Award for Best Business Practices at EcoBalance 2018 (the 13th Biennial International Conference on EcoBalance), for initiatives relating to evaluating the environmental impact of energy and resource use, with an aim toward the fulfillment of the United Nation’s sustainable development goals (SDGs).
Infineon at electronica 2018: Electromobility is being made fit for long distances, drones are coming of age, and robots are becoming agile: 11/5/2018 7:04:20 AM; Infineon Technologies AG gives answers to the major questions related to digitization: How can clean energy be produced and how does it get into the electric car quickly and with low losses? What makes servers more efficient as we transfer more and more data to the cloud? How suitable are robots already for use in everyday life? And how do we protect ourselves in a connected …
General Dynamics Mission Systems Demonstrates New Mobile Encryptor for Secure Voice, Video and Data: 11/2/2018 1:26:28 PM; General Dynamics Mission Systems has announced the expansion of its TACLANE portfolio, the world’s most widely deployed family of Type 1 encryptors, with the new, small form-factor mobile encryptor, the TACLANE-Nano (KG-175N).
Heraeus Medical Components expands neuromodulation capabilities with acquisition of Evergreen Medical Technologies: 11/1/2018 3:48:44 PM; Heraeus Medical Components, a global business unit of Heraeus Holding GmbH, has entered into an agreement to acquire Evergreen Medical Technologies and its subsidiary, PhysioTest, effective October 31st.
Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market: 10/30/2018 4:09:05 AM; Samsung Electronics, a world leader in advanced semiconductor technology, introduced two new 0.8-micrometer (μm) pixel image sensors – the 48-megapixel (Mp) Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL Bright GD1.
Yaskawa Names Delta T Equipment as HVAC Channel Partner in Houston Market: 10/30/2018; Paul McCarver, CEO and founder of Delta T Equipment, recently announced that the Houston-based HVAC distributorship has entered into an agreement with equipment manufacturer Yaskawa to sell their products to the South Texas commercial HVAC market.
World’s first TPM for cybersecurity in the connected car: 10/25/2018 4:55:47 AM; Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is enabling a crucial step toward greater cybersecurity in the connected car. The Munich-based company is the world’s first semiconductor manufacturer to put a Trusted Platform Module (TPM) specifically for automotive applications on the market.
DENSO’s Second Founding: Company Shift in Strategy to Craft the Core Technologies for the Future of Mobility: 10/24/2018 3:04:10 PM; DENSO corporation (DENSO), the world’s second largest mobility supplier, has made recent changes that represent one of the largest shifts in business strategy in its 70-year history – expanding into software-based solutions in addition to its hardware expertise – that push the company beyond a vehicle-centric focus in order to help create an new mobility paradigm for society.