Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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What does ZEISS have to do with the Moon landing and microchips?: 11/20/2019 7:15:15 AM; The Long Night of the Sciences will once again be running 350 events at 65 locations to provide fascinating insights into what Jena has on offer in terms of the variety of science and research.
Rockwell Automation and Accenture Industry X.0 Combine Forces to Create Digital Solutions for Industrial Clients: 11/19/2019 3:31:52 PM; Today, Rockwell Automation, Inc (NYSE: ROK) and Accenture’s (NYSE: ACN) Industry X.0 announced plans to team up to develop a digital offering to help industrial clients move beyond existing manufacturing solutions to transform their entire connected enterprise.
Hitachi and Cambridge renew 30 year research partnership: 11/19/2019 8:37:15 AM; The University of Cambridge ("the University") and Hitachi, Ltd. (TSE: 6501, "Hitachi"), announced that they have signed a new agreement to continue and grow their long-standing relationship through the Hitachi Cambridge Laboratory (HCL), part of the European R&D Centre of Hitachi Europe Ltd., a wholly owned subsidiary of Hitachi.
AT&T Validates Qualcomm 9205 LTE Modem on Carrier’s Low-Power Wide-Area Networks: 11/18/2019 12:01:09 PM; Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced that AT&T has validated its Qualcomm® 9205 LTE multimode modem’s capabilities for the carrier’s LTE-M and NB-IoT networks.
Intel Board of Directors Elects New Director: 11/14/2019 6:15:46 PM; Intel Corporation today announced that James (Jim) J. Goetz was elected to Intel’s board of directors. His election marks the sixth new independent director added to Intel’s board since the beginning of 2016.
Telit’s simWISE Embedded SIM Technology Supports 5G-Ready LTE-M and NB-IoT Modules: 11/13/2019 9:11:57 AM; Innovative module-software embedded SIM technology expands from 2G to deliver simplification in logistics, lower costs and massive scalability to 4G cellular IoT Telit simWISE is an integral part of the company’s global connectivity offering and award winning Telit OneEdge suite of software, SaaS and PaaS, enabler of 5G-ready IoT at scale Telit, a global enabler of the …
ASM International N.V. Launches A400™ DUO Vertical Furnace System: 11/11/2019 1:24:40 PM; ASM International N.V. (Euronext Amsterdam: ASM) today introduced the A400 ™ DUO vertical furnace system with dual reactor chambers for wafer sizes of 200mm and smaller.
POET Announces Successful Closing of DenseLight Sale: 11/8/2019 5:00:21 PM; POET Technologies Inc. (“POET” or the “Company”) (OTCQX: POETF; TSX Venture: PTK), the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center and tele-communication markets, today announced the successful closing of the sale of its DenseLight subsidiary in Singapore and the receipt of the first tranche payment from …
Helium Activates the World’s First Sharing-Economy Wireless Network in 425+ US Cities: 11/7/2019 12:35:08 PM; SAN FRANCISCO (Nov. 7, 2019) -- Helium, the world’s first sharing-economy wireless network, today announces that it is live in over 425 cities spanning 45 of the 50 states.
Rohde & Schwarz together with Fraunhofer Institutes HHI and IAF join forces in researching 6G at THz frequencies: 11/6/2019 5:07:02 PM; While the new 5G technology is at the first stages of rollout, Rohde & Schwarz, the Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI and the Fraunhofer Institute for Applied Solid State Physics IAF are taking a step further with demonstrations in the terahertz (THz) frequency band, related to the 6th generation wireless mobile communication (6G).
Qualcomm Names Akash Palkhiwala as Chief Financial Officer: 11/6/2019 4:38:38 PM; Qualcomm Incorporated (NASDAQ: QCOM) today announced that its Board of Directors has unanimously approved the appointment of Akash Palkhiwala as executive vice president and chief financial officer.
G+D Mobile Security collaborates with lowRISC to support OpenTitan, a new open source project: 11/6/2019 2:23:32 PM; G+D Mobile Security, a leading provider of connectivity and security in IoT, today announced it has partnered with lowRISC and Google in support of OpenTitan, an open source hardware root of trust (RoT) reference design and integration guidelines that enable chip producers and platform providers to build transparently implemented, high-quality hardware RoT chips tailored for …
New technology for mature applications: CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW: 11/6/2019 11:31:55 AM; Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now targeting the next group of applications for this wide bandgap technology: The evaluation board EVAL-M5-E1B1245N-SiC will help to pave the way for SiC in motor drives and help strengthening Infineon’s …
Western Digital Collaborates With lowRISC and Google to Increase Security Transparency in Data-Centric Platforms: 11/5/2019 5:28:22 PM; Western Digital Corp. (NASDAQ: WDC) today announced that it has teamed up with lowRISC, Google and a coalition of partners in support of OpenTitan, the first open-source project building transparent, high-quality reference design and integration guidelines for silicon root of trust (RoT) chips that can be used in data storage, compute, and other hardware platforms.
Epson and 4D Sensor Forge Capital and Business Ties: 10/31/2019 1:56:19 PM; Seiko Epson Corporation (TSE: 6724, "Epson") has invested in venture company 4D Sensor Inc., and the parties have entered into a partnership agreement aimed at creating new value using high-speed 3D measurement technology.
A Hero for Every Gamer: NVIDIA Introduces New GeForce GTX SUPER Series: 10/29/2019 11:50:31 AM; In the latest addition to its GeForce® GTX® family of gaming GPUs, NVIDIA today unveiled the GeForce GTX 1660 SUPER -- the successor to its most successful GPU ever -- as well as the GeForce 1650 SUPER.
Samsung Electronics Begins Mass Production of Industry’s First 12GB LPDDR4X-based uMCP: 10/28/2019 6:30:45 PM; Samsung Electronics, a world leader in advanced memory technology, announced that it has begun mass producing the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP).