Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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Tianma exhibiting new smartphone AM-OLED technology at CES 2026: 1/9/2026 2:25:49 PM; Tianma, a leading global manufacturer of flat panel displays, is exhibiting its next generation of AM-OLED displays, designed to improve brightness, color reproduction, efficiency and form factor for smartphone applications.
Sumitomo Chemical to Attend SPIE Photonics West 2026 to Exhibit its Compound Semiconductor Products and Present an Invited Talk: 1/9/2026 2:18:10 PM; Sumitomo Chemical will participate in SPIE Photonics West 2026, the world’s largest optics and photonics conference and exhibition, to be held in San Francisco, California, the United States, from Tuesday, January 20 to Thursday, January 22, 2026.
Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles: 1/8/2026 1:20:45 PM; Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and HL Klemove have signed a Memorandum of Understanding (MoU) to strengthen their strategic collaboration in automotive technologies.
SPIE Photonics West Preview: Phlux Technology Booth 5528 - 1550 nm IR Sensors: 1/7/2026 7:20:51 PM; Phlux Technology, a manufacturer of avalanche photodiode (APD) infrared (IR) sensors, will be showcasing its Aura family of Noiseless InGaAs® APDs at SPIE Photonics West, San Francisco, January 20-22, 2026, on booth 5528.
Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT: 1/7/2026 2:45:49 PM; To support continued growth of connected devices in home, industrial and commercial markets, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth® LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device.
ams OSRAM takes the stage at CES 2026 – Combining light, sensors and software to transform industries and improve lives: 1/6/2026 3:27:14 PM; • ams OSRAM will show more than a dozen interactive displays and immersive demonstrations of its latest LEDs, lasers, LED drivers and sensors in an exclusive meeting room at the Venetian Expo, January 6 – 9, 2026.
From Building Bricks to Brilliance: Model of Intel Series 3 Processor Steals the Show: 1/6/2026 1:00:32 PM; The mockup of an actual Intel® Core™ Ultra Series 3 (code-named Panther Lake) chip even lights up, thanks to 600+ LEDs and complicated circuitry hidden within its LEGO tiles – mimicking the way a real-life Series 3 processor functions.
3D Systems Accelerates Growth in Aerospace & Defense with Strategic Investments and Projected Leadership Position: 1/5/2026 3:19:16 PM; 3D Systems (NYSE: DDD), a leading provider of additive manufacturing solutions, today announced significant momentum in its Aerospace & Defense (A&D) business, including robust revenue growth projections, a major U.S.
World’s first 802.15.4ab-UWB chip verified by Calterah and Rohde & Schwarz to be demoed at CES 2026: 1/5/2026 3:11:49 PM; Calterah, a global leader in chip design for CMOS single-chip millimeter-wave radar sensors, together with Rohde & Schwarz, a world-leading company in test and measurement, has successfully demonstrated its next-generation solution for digital car keys based on the Dubhe-UWB-SoC chip (Ultra-Wideband; System-on-Chip).
Infineon and Flex launch Zone Controller Development Kit for software-defined vehicles at CES 2026: 1/5/2026 10:16:25 AM; Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Flex take the next step in their collaboration to accelerate the development of software-defined vehicles (SDVs).
SoftBank Corp., Ericsson, Qualcomm Technologies trial 5G and 5G Advanced capabilities including L4S on 5G SA commercial network: 12/26/2025 10:26:35 AM; SoftBank Corp. ("SoftBank") and Ericsson Japan K.K. ("Ericsson"), in collaboration with Qualcomm Technologies, Inc. ("Qualcomm Technologies"), have successfully conducted a field trial of low-latency communications using several 5G and 5G Advanced technologies – including Low Latency, Low Loss, and Scalable Throughput (L4S) – on SoftBank’s 5G Standalone (5G SA) commercial …
Endress+Hauser invests in Freiburg, Germany: 12/23/2025 5:39:22 PM; Over the next few years, Endress+Hauser will develop its own corporate campus in Freiburg, Germany. For this purpose, the Swiss specialist in measurement and automation technology has acquired a plot of land measuring about 20,000 square meters in the city’s Green Industry Park from a commercial real estate development agency (Freiburg-S-Wirtschaftsimmobilien GmbH & Co.