Semiconductors News and Press Releases

Semiconductors

Releases published in the last 30 days.

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Intel Delivers ‘Real-Time AI’ in Microsoft’s New Accelerated Deep Learning Platform: 8/23/2017 12:33:56 PM; Artificial intelligence (AI) and deep learning (DL) promise to transform how people engage with the world and how businesses operate in order to make smarter decisions, and Intel® technology is enabling this transformation.
Stacy Smith to Retire after 30 Years at Intel: 8/23/2017 8:15:43 AM; In an email today, Intel CEO Brian Krzanich announced that Stacy Smith, Group President of Manufacturing, Operations and Sales at Intel, has decided to retire from the company at the end of January 2018.
EMSL’s Materials Testing Lab Provides Nanomaterials Analysis: 8/16/2017 8:56:45 AM; Nanomaterials are steadily becoming a ubiquitous part of engineering, being used for everyday consumer electronics, advanced therapy drug delivery systems and more.
Fluke Process Instruments Launches New Website Combining Industrial Temperature Measurement Solutions: 8/15/2017 12:43:09 AM; Fluke[sup]®[/sup] Process Instruments has announced the launch of a new website, www.flukeprocessinstruments.com, combining its extensive global capabilities in industrial temperature measurement.
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: 8/9/2017 2:51:14 PM; GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs).
Renesas Electronics’ R-Car SoC Accelerates Development of In-Vehicle Infotainment Applications with Support of Automotive Grade Linux Platform: 8/9/2017 2:47:17 PM; Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has started volume shipment of its first R-Car system-on-chip (SoC) incorporating Automotive Grade Linux (AGL)-based software.
TSMC Board of Directors Meeting Resolutions: 8/9/2017 2:44:42 PM; TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which approved capital appropriations of approximately US$3,153.6 million for purposes including: 1) Construction of fab facilities for US$528 million; 2) Other purposes for US$2,625.6 million including: Expanding and upgrading advanced technology equipment; Expanding advanced packaging technology capacity; …
Media Alert: New 8th Gen Intel Core Processor Family to Debut Aug. 21: 8/9/2017 8:51:52 AM; On Aug. 21, Intel will unveil the 8th Generation Intel® Core™ processor family on Facebook Live. Watch as two exciting moments align: the Great American Solar Eclipse and the unveiling of Intel’s most powerful family of processors for the next era of computing.
Samsung Introduces Far-reaching V-NAND Memory Solutions to Tackle Data Processing and Storage Challenges: 8/9/2017 8:32:30 AM; Samsung Electronics, the world leader in advanced memory technology, has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.
DENSO Establishes a New Company Designing Key Components Enabling Automated Driving: 8/8/2017 8:44:45 AM; DENSO Corporation today announced that it will establish a new company, NSITEXE, Inc., to design and develop semiconductor IP cores*1, which are key semiconductor components enabling automated driving.
Termination of Research and Business Development of Silicon Carbide (SiC) Single Crystal Wafers: 8/8/2017 8:32:08 AM; Nippon Steel & Sumitomo Metal Corporation (“NSSMC”) has been researching and developing 150-mm (6-inch) SiC single crystal wafers*1 for power semiconductor devices*2 using the sublimation-recrystallization method at the Advanced Technology Research Laboratories under the R & D Laboratories.
STMicroelectronics Completes Share Buy-back Program: 8/7/2017 8:02:07 AM; STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it has completed the repurchase of approximately 18.6 million shares of its common stock for an amount of $297 million under its share buy-back program announced on June 22, 2017.
Epson Shipping Samples of Six New 16-bit MCUs in the S1C17M2 Series: 8/3/2017 7:59:58 AM; Seiko Epson Corporation (TSE: 6724, "Epson") has begun shipping samples of the S1C17M20, a low-power 16-bit microcontroller unit (MCU) with on-chip flash memory.
Revenue growth driven by industrial applications and power supplies. Growing semiconductor content per vehicle keeps Automotive business buoyant: 8/1/2017 8:32:17 AM; • Q3 FY 2017: Revenue €1,831 million; Segment Result €338 million; Segment Result Margin 18.5 percent; earnings per share €0.22 (basic and diluted); adjusted earnings per share €0.24 (diluted); gross margin 38.2 percent, adjusted gross margin 39.4 percent • Outlook for Q4 FY 2017: At an assumed exchange rate of US$1.15 to the euro expected revenue about the same level …
Samsung’s New LTE Modem Technology Supports Industry-First 6CA, Delivering Fast and Seamless Mobile Communication Experiences: 7/31/2017 5:20:36 AM; Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed LTE modem technology for the company’s next-generation mobile processors that supports 6CA (carrier aggregation) for the first time in the industry.
Samsung Electronics Announces Second Quarter 2017 Results: 7/28/2017 7:26:20 AM; Samsung Electronics announced financial results for the second quarter ended June 30, 2017. Samsung’s revenue for the quarter was KRW 61.00 trillion, an increase of KRW 10.06 trillion YoY, while operating profit for the quarter posted a record KRW 14.07 trillion, an increase of KRW 5.92 trillion YoY.