Semiconductors News and Press Releases

Semiconductors

Releases published in the last 30 days.

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STMicroelectronics’ integrated flyback controller with advanced features boosts LED lighting performance: 2/6/2023 8:53:52 AM; Geneva, February 6, 2023 – STMicroelectronics’ HVLED101 90-400V flyback controller for LED-lighting applications up to 180W enhances performance and simplifies design through extensive feature integration, patented control techniques, and support for primary-sensing regulation.
STMicroelectronics reveals single-chip antenna-matching ICs for easier, faster design with Bluetooth® LE SoCs and STM32 wireless microcontrollers: 2/2/2023 8:18:23 AM; Geneva, February 2, 2023 – STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x* wireless microcontrollers.
STMicroelectronics simplifies high-efficiency two-port USB-PD adapters with ST-ONEMP digital controller: 2/1/2023 8:44:58 AM; Geneva, February 1, 2023 – STMicroelectronics is extending its highly integrated and power-saving ST-ONE family of USB Power Delivery (USB-PD) digital controllers by introducing the ST-ONEMP, which supports two power outputs.
Scout Ventures Welcomes Cody Huggins and Taylor Craig as Principal and Associate: 1/26/2023 12:00:00 PM; Scout Ventures, an Austin-based venture capital firm, is excited to announce that Cody Huggins has joined the firm as a Principal and Taylor Craig as an Associate in the Austin office.
STMicroelectronics’ dual-channel digital isolators cover flexible configurations: 1/16/2023 8:51:44 AM; Geneva, January 16, 2023 – STMicroelectronics has extended its family of dual-channel high-speed digital isolators, enhancing flexibility for designers to optimize their board layout.
Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials: 1/16/2023 4:51:53 AM; Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021.
STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package: 1/9/2023 8:48:33 AM; Geneva, January 9, 2023 – STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK™ SMIT package that eases assembly and enhances power density over conventional TO-style packages.