Semiconductors News and Press Releases

Semiconductors

Releases published in the last 30 days.

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Quadric.io Announces $15M in Funding to Build First Ever Supercomputer for Edge Devices: 5/14/2019 12:00:00 PM; Quadric.io is making a bold entrance into the computing space today, announcing it is building the world’s first supercomputer specifically designed for the real-time needs of autonomous systems.
STMicroelectronics’ Programmable Power-Management Device Saves Space and Increases Reliability in Advanced Driver-Assistance Systems: 5/13/2019 9:25:18 AM; Geneva, May 13, 2019 -- The STMicroelectronics L5965 seven-output automotive power-management IC (PMIC) enables more compact and reliable electronic control units for automotive-vision systems and other in-vehicle applications, leveraging direct operation from battery voltage with register-programmable output voltages and sequencing and integrated functional-safety …
SIGLENT Technologies Introduces Programmable DC Loads: 5/13/2019 8:00:00 AM; SIGLENT Technologies has introduced the SDL1000X and SDL1000X-E series of programmable electronic DC Loads, which are designed for battery, solar cell, and power supply testing.
Cadence Delivers Smart JasperGold Formal Verification Platform: 5/9/2019 4:42:48 PM; Cadence Design Systems, Inc. (NASDAQ: CDNS) announced the third-generation Cadence® JasperGold® Formal Verification Platform, featuring machine learning technology and core formal technology enhancements.
Samsung Introduces Exynos i T100 for Secure and Reliable IoT Devices with Short-Range Connectivity: 5/7/2019 2:00:44 PM; Samsung Electronics, a world leader in advanced semiconductor technology, today announced a new Internet of Things (IoT) solution, the Exynos i T100, which enhances the security and reliability of devices designed for short-range communications.
STSPIN32 Single-Shunt BLDC Motor Controller from STMicroelectronics Saves Space, Time, and Bill of Materials: 5/6/2019 9:43:30 AM; Geneva, May 6, 2019 -- STMicroelectronics has expanded its STSPIN32 programmable motor controller family with the STSPIN32F0B system-in-package (SiP) for cost-effective one-shunt current sensing.
Samsung Electronics Expands SAIT AI Lab Montreal to Spur AI Research for Next-Generation System Semiconductor: 5/2/2019 8:50:24 AM; Samsung Electronics today announced the expansion of the ‘Samsung Advanced Institute of Technology (SAIT) artificial intelligence (AI) Lab Montreal’ in Canada.
Samsung Electronics Announces First Quarter 2019 Results: 5/1/2019 1:09:50 PM; Samsung Electronics posted KRW 52.4 trillion in consolidated quarterly revenue and KRW 6.2 trillion in quarterly operating profit. First quarter earnings were weighed down by the weakness in memory chips and displays, although the newly launched Galaxy S10 smartphone logged solid sales.
STMicroelectronics’ 650V High-Frequency IGBTs Boost Performance with Latest High-Speed Technology: 4/29/2019 9:02:47 AM; Geneva, April 29, 2019 -- The STMicroelectronics HB2 650V IGBT series delivers efficiency and performance gains for medium- and high-speed applications such as PFC converters, welders, uninterruptible power supplies (UPS), and solar inverters, leveraging ST’s latest Trench Field Stop (TFS) technology.
Hosting of ‘Open University Week’ for the Celebration of UNIST’s 10th Anniversary: 4/29/2019 7:19:14 AM; UNIST will open its doors to the public in celebration of its 10th anniversary of opening and 12th anniversary of establishment. Under the topic of “UNIST Builds its 10th Bridge”, it plans to offer a variety of events and things to see, do, and enjoy during this 9-day event.
Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology: 4/24/2019 12:49:34 PM; Cadence Design Systems, Inc. (NASDAQ: CDNS) announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC™ ) 3D advanced chip stacking technology, which integrates heterogenous chips—including logic ICs and memory—that are fabricated on different process nodes onto a single chip stack for a subsequent packaging process.
Samsung Electronics to Invest KRW 133 Trillion in Logic Chip Businesses by 2030: 4/24/2019 12:05:17 PM; Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will invest KRW 133 trillion by 2030 to strengthen its competitiveness in System LSI and Foundry businesses.
ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility: 4/22/2019 12:44:11 PM; ON Semiconductor Corporation (Nasdaq: ON ) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York.