Semiconductors
Releases published in the last 30 days. 
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- MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services
- 11/11/2019 2:35:17 PM
- MediaTek announced the expansion of its ASIC services with the 112G Long Range (LR) SerDes IP chip. Available with silicon-proven 7nm FinFET process technology, MediaTek’s 112G LR SerDes enables data centers to quickly and efficiently process high volumes of specific types of data, accelerating the speed of computing.
- ASM International N.V. Launches A400™ DUO Vertical Furnace System
- 11/11/2019 1:24:40 PM
- ASM International N.V. (Euronext Amsterdam: ASM) today introduced the A400 ™ DUO vertical furnace system with dual reactor chambers for wafer sizes of 200mm and smaller.
- POET Announces Successful Closing of DenseLight Sale
- 11/8/2019 5:00:21 PM
- POET Technologies Inc. (“POET” or the “Company”) (OTCQX: POETF; TSX Venture: PTK), the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center and tele-communication markets, today announced the successful closing of the sale of its DenseLight subsidiary in Singapore and the receipt of the first tranche payment from …
- Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
- 11/8/2019 1:48:04 PM
- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Altair Semiconductor ( altair-semi.com ), a leading provider of cellular IoT chipsets, jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market.
- MediaTek Collaborates with Microsoft to Accelerate the Development of Internet of Things Solutions
- 11/8/2019 1:45:42 PM
- MediaTek announced it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services.
- Toshiba Group Joins Open Invention Network Community
- 11/8/2019 1:43:17 PM
- Toshiba Corporation (Tokyo: 6502) announced today that Toshiba Group has joined Open Invention Network (OIN) as a community member. OIN is a community that aims to establish a safe environment that eliminates patent risk by cross-licensing patents between OIN member companies for the Linux System, a major software program that includes the Linux OS.
- STMicroelectronics Adds Support for LoRaWAN® Firmware Update Over The Air in the STM32Cube Ecosystem
- 11/7/2019 3:43:53 AM
- Geneva, November 6, 2019 -- STMicroelectronics has enhanced its STM32* LoRaWAN® software expansion package for developers ( I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.
- Apple, eBay, Samsung Austin Semiconductor and Sprint Accelerate Renewable Energy Development
- 11/6/2019 11:42:50 AM
- Apple, eBay, Samsung and Sprint announced a joint agreement to purchase power from a new wind farm owned and developed by Apex Clean Energy. The transaction—spearheaded by Apple, the largest purchaser in the innovative small load energy aggregation—totals approximately 75 megawatts of clean energy, enough to power the equivalent of 20,000 homes.
- New technology for mature applications: CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW
- 11/6/2019 11:31:55 AM
- Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now targeting the next group of applications for this wide bandgap technology: The evaluation board EVAL-M5-E1B1245N-SiC will help to pave the way for SiC in motor drives and help strengthening Infineon’s …
- Complete USB Type-C Port-Protection IC from STMicroelectronics Simplifies Connectivity Upgrade for Mass-Market Devices
- 11/5/2019 12:00:00 PM
- Geneva, November 5, 2019 -- Designers can easily migrate small electronic devices from legacy USB® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.
- Renesas Premieres RE Family for Its SOTB™ Process-Based Energy Harvesting Embedded Controller Portfolio
- 11/1/2019 12:40:09 PM
- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced its RE Family, which encompasses the company’s current and future lineup of energy harvesting embedded controllers.
- TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
- 11/1/2019 12:28:27 PM
- TSMC and GLOBALFOUNDRIES (GF) today announced they are dismissing all litigation between them as well as those that involve any of their customers. The companies have agreed to a broad life-of-patents cross-license to each other’s worldwide existing semiconductor patents as well as those patents that will be filed during the next ten years as both companies continue to invest …
- STMicroelectronics Updates TouchGFX Suite to Elevate User Interfaces and Reduce Memory and CPU Needs in STM32 Microcontrollers
- 10/28/2019 10:01:27 AM
- Geneva, October 28, 2019 -- STMicroelectronics has updated the TouchGFX user-interface software framework for STM32 microcontrollers, adding new features that enable smoother and more dynamic user interfaces and lower demand on the memory and CPU.
- Microchip Solves Interoperability Challenges of Delivering up to 90 Watts of Power Over Ethernet Wiring
- 10/23/2019 10:01:41 AM
- As the industry adopts the latest generation of PoE technology for managing data and power over a single Ethernet cable, users face the challenge of making pre-standard powered devices (PDs) work alongside new IEEE ® 802.3bt-2018-compliant PDs in an existing Ethernet infrastructure.
- New Transient-Voltage-Suppression Diodes from STMicroelectronics Deliver Higher Protection in Smaller Packages
- 10/21/2019 8:49:53 AM
- Geneva, October 21, 2019 -- The latest generation of transient-voltage-suppression (TVS) diodes from STMicroelectronics delivers market-leading power density, handling 600W and 1500W transient power in SMB Flat, and 400W and 600W in SMA Flat packages that are just 1.0mm high.
- IDT Offers Avalanche Technology’s MRAM Devices to Complement its Broad Range of Semiconductor Devices
- 10/18/2019 12:51:08 PM
- Integrated Device Technology, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), today announced that it now offers Avalanche’s magnetic RAM (MRAM) devices to complement the extensive range of power, sensor, timing and microcontroller devices from Renesas.
- Affordable LoRa® Development Packs from STMicroelectronics Jump-Start Projects Leveraging Large-Scale LPWAN Connectivity
- 10/17/2019 8:49:26 AM
- Geneva, October 17, 2019 -- STMicroelectronics has introduced two $99 ready-to-use development packs that enable all types of users from large corporations to smaller companies, independent designers, hobbyists, and schools to utilize LoRa® ’s long-range, low-power wireless IoT connectivity for tracking, positioning, metering, and many other applications.
- MediaTek to Integrate Sony’s 360 Reality Audio Technology into its Audio Chipset Portfolio
- 10/16/2019 10:12:55 AM
- MediaTek today announced it will integrate Sony’s innovative 360 Reality Audio technology into MediaTek’s portfolio of audio solutions. MediaTek’s audio chipsets are designed to bring high-quality, high resolution audio to sound bars, smart speakers and other connected audio devices.
- STMicroelectronics Launches Next-Gen Payment System-on-Chip with Increased Performance and Protection
- 10/16/2019 8:55:27 AM
- Geneva, October 16, 2019 -- STMicroelectronics has released the next generation of its STPay system-on-chip (SoC) payment solution, leveraging state-of-the-art technology to increase contactless performance and protection, reduce power demand, and significantly improve the user experience.
- Panasonic to Team up with IBM Japan in Improving Semiconductor Manufacturing Processes
- 10/16/2019 8:43:23 AM
- IBM Japan, Ltd. and Panasonic Corporation’s subsidiary, Panasonic Smart Factory Solutions Co., Ltd. (hereafter "Panasonic"), announced today that the companies have agreed to collaborate to develop and market a new high-value-added system to optimize the overall equipment effectiveness (OEE) of customers’ semiconductor manufacturing processes and to realize high-quality …
