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Semiconductors

Releases published in the last 30 days. RSS 0.91 Feed

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STMicroelectronics Eases Access to STM32WB Dual-Core Wireless MCUs for Bluetooth® LE 5.0, Zigbee® 3.0, and Thread Connectivity
STMicroelectronics Eases Access to STM32WB Dual-Core Wireless MCUs for Bluetooth® LE 5.0, Zigbee® 3.0, and Thread Connectivity
10/20/2020 8:47:48 AM
Geneva, October 20, 2020 – STMicroelectronics has expanded the STM32WB portfolio of dual-core multi-protocol microcontrollers (MCUs) by introducing the STM32WB35 and STM32WB30 Value Line, giving designers more flexibility to target cost-conscious market opportunities.
IEEE Quantum Week: Intel Highlights Full-Stack Quantum Research
IEEE Quantum Week: Intel Highlights Full-Stack Quantum Research
10/12/2020 7:25:02 PM
What’s New:  During the  IEEE International Conference on Quantum Computing and Engineering this week, Intel is presenting a body of research highlighting its full-stack approach to quantum innovation spanning hardware, software and algorithm development.
STMicroelectronics Eases Simple GUI Design for Ultra-Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield
STMicroelectronics Eases Simple GUI Design for Ultra-Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield
10/12/2020 8:45:56 AM
Geneva, October 12, 2020 – STMicroelectronics is pioneering the HMI of things with a new STM32* Nucleo display shield that leverages the affordability of STM32G0 microcontrollers (MCUs).
Renesas Appoints Andreas Hammer as Vice President of European Sales for the IoT and Infrastructure Business Unit
Renesas Appoints Andreas Hammer as Vice President of European Sales for the IoT and Infrastructure Business Unit
10/9/2020 4:08:45 PM
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced the appointment of Andreas Hammer as Vice President of Sales for the IoT and Infrastructure Business Unit in Europe, effective October 1, 2020.
Picosun’s cluster ALD solutions enable next generation power electronics
Picosun’s cluster ALD solutions enable next generation power electronics
10/7/2020 12:18:21 PM
Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, strengthens its position in power electronics market with several cluster ALD system sales to prominent manufacturers in Europe, USA and Asia.
STMicroelectronics Introduces Bluetooth® 5.2-Certified SoC, Extending Range, Throughput, Reliability and Security
STMicroelectronics Introduces Bluetooth® 5.2-Certified SoC, Extending Range, Throughput, Reliability and Security
10/7/2020 9:16:25 AM
Geneva, October 7, 2020 – STMicroelectronics has revealed its latest BlueNRG-LP Bluetooth® LE System-on-Chip (SoC), which leverages the latest Bluetooth features to increase communication range, raise throughput, strengthen security, and save power.
Focus on electro-mobility: Infineon on board for marathon ride through Germany
Focus on electro-mobility: Infineon on board for marathon ride through Germany
9/28/2020 7:13:00 PM
65 days, around 640 charging stations, more than 20,000 kilometers – Infineon (FSE: IFX / OTCQX: IFNNY) is a partner of the ID.3 Tour across Germany, a marathon drive in Volkswagen’s new electric model.
STMicroelectronics Simplifies Sensor Connections with Flexible, Configurable Dual I/O-Link and SIO Transceiver
STMicroelectronics Simplifies Sensor Connections with Flexible, Configurable Dual I/O-Link and SIO Transceiver
9/28/2020 8:48:46 AM
Geneva, September 28, 2020 – STMicroelectronics is bringing extra flexibility to IO-Link connections with the L6364 transceiver, which features dual communication channels that allow configurable output doubling for extra drive strength, in addition to a DC/DC converter and dual-mode UART.
Toshiba’s IGBT and FWD Compact Modeling Realizes Highly Accurate Prediction of Power Efficiency and EMI Noise for Multiple External Condition
Toshiba’s IGBT and FWD Compact Modeling Realizes Highly Accurate Prediction of Power Efficiency and EMI Noise for Multiple External Condition
9/25/2020 4:20:22 PM
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a compact model for simulating and predicting power efficiency and electromagnetic interference (EMI) noise in Insulated Gate Bipolar Transistors (IGBT) and Free Wheeling Diodes (FWD).
Advantest Introduces Evolutionary V93000 EXA Scale™ SoC Test System
Advantest Introduces Evolutionary V93000 EXA Scale™ SoC Test System
9/24/2020 7:08:23 PM
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has announced its next-generation V93000 testers targeted at advanced digital ICs up to the exascale performance class.
STMicroelectronics Releases KNX-RF Software for Power-Conscious Building Automation
STMicroelectronics Releases KNX-RF Software for Power-Conscious Building Automation
9/24/2020 9:08:53 AM
Geneva, September 24, 2020 – STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls.
STMicroelectronics Reveals BlueNRG-2N Network Processor Combining Convenience and Scalability, with Bluetooth® 5.0 Features and Security
STMicroelectronics Reveals BlueNRG-2N Network Processor Combining Convenience and Scalability, with Bluetooth® 5.0 Features and Security
9/22/2020 8:54:11 AM
Geneva, September 22, 2020 – STMicroelectronics has unveiled the BlueNRG-2N Bluetooth 5.0-certified network processor, lowering power consumption and adding support for the latest Bluetooth features that increase data throughput and enhance privacy and security.

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