TMP and BASF to jointly develop electronic materials for copper and barrier CMP-slurries

TMP grants technology license to BASF

04/03/06, TMP and BASF announced today that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). This agreement will leverage TMP’s leading technological position and BASF’s expertise in nanotechnology, product development and global marketing and distribution. Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.

The new agreement is a significant expansion of BASF’s activities in the electronic materials markets and targets the highly innovative area of copper and barrier CMP-slurries. These are important process chemicals for the planarization of silicon wafers. The two companies will jointly focus on product - and hence customer process - improvements by combining BASF’s chemical and nanotechnology expertise and market knowledge with TMP’s application and product know how.

“TMP and BASF intend to leverage their combined expertise in copper- and barrier CMP-polishing and chemistry aimed at system innovations for the semiconductor industry,” said Takehisa Ohkawa, chief executive of TMP.

“We look forward to addressing our customers with our strengthened CMP-portfolio and to find the right solution for their polishing needs in order to help them to be more successful,” said Dr. Karl-Rudolf Kurtz, Group Vice President of BASF’s global business unit Electronic Materials. “TMP has a well-established track record of developing and applying copper and barrier CMP-slurries to customers in the Japanese home market. Through this license and joint development agreement, TMP and BASF will benefit twofold: by combining TMP’s products with BASF’s global customer reach as well as joining TMP’s application know-how with BASF’s very broad chemical expertise”, stated Kurtz.

BASF has a long-standing experience in the area of high purity chemicals and tailor-made formulations for the semiconductor and flat panel display industry. TMP has advanced technology and specific products in the field of fine and precise polishing and planarization for the semiconductor and hard disk drive industry.

BASF is the world’s leading chemical company: The Chemical Company. Its portfolio ranges from chemicals, plastics, performance products, agricultural products and fine chemicals to crude oil and natural gas. As a reliable partner to virtually all industries, BASF’s intelligent system solutions and high-value products help its customers to be more successful. BASF develops new technologies and uses them to open up additional market opportunities. It combines economic success with environmental protection and social responsibility, thus contributing to a better future. In 2005, BASF had approximately 81,000 employees and posted sales of more than €42.7 billion. BASF shares are traded on the stock exchanges in Frankfurt (BAS), London (BFA), New York (BF) and Zurich (AN). Further information on BASF is available on the Internet at www.basf.com.

TMP is the technology orientated joint venture established in 1970 by Toppan Printing Co., Ltd. and TDK Corporation to develop and commercialize the high security magnetic and IC card media and system. In addition to such domain, TMP has evolved its portfolio toward the fine polishing industry in deepening the micro-dispersion, chemical formulation and precise coating technology. TMP’s specific and tailor-made polishing products are widely contributing to the fine electronics industry. Further information on TMP is available at www.tmp.co.jp.

Contact Information

Andrea Hördt

BASF

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