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TransDimension Aims to Simplify the Implementation of USB into Mobile Devices


IRVINE, CA -- Feb. 15, 2005 -- TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that its host controller driver (HCD) for the TD242LP USB host, peripheral and OTG controller for use with the Windows CE 5.0 operating system has passed validation in the Microsoft Driver Validation Program for Windows CE. By providing drivers certified through the Microsoft Driver Validation Program for Windows CE 5.0, TransDimension ensures the compatibility of its technology with mobile devices running Windows CE 5.0, which reduces risk for its customers and shortens their design cycle.

TransDimension’s USB controller driver is readily available to customers via a Microsoft third-party partner solutions CD and ships with Platform Builder for Microsoft Windows CE 5.0. This allows customers to use the integrated development environment (IDE) to build customized embedded operating system (OS) designs based on the Microsoft Windows CE OS. It also enables customers to obtain the driver directly from Microsoft free of charge, along with the rights to distribute the software in object code form.

“We are very pleased TransDimension is committed to delivering technologies that are 100 percent compatible with the Windows CE 5.0 device platform,” said Jane Gilson, director, Mobile and Embedded Devices Division at Microsoft Corp. “TransDimension’s innovation and contribution to connectivity in the mobile devices space will help our mutual customers decrease their design cycle and ensure seamless compatibility.”

Many TransDimension customers use the TD242LP and Windows CE in their mobile applications. The TD242LP HCD for Windows CE 5.0 enables embedded designers to easily add USB host functionality to their mobile products, such as cell phones, portable media centers, MP3 players, mobile storage devices and PDAs. The TD242LP HCD was written to interface seamlessly with the native Windows CE 5.0 USB host stack, requiring no software modifications. By implementing the HCD into their system, mobile device designers and manufacturers can support all USB devices that the Windows CE USB host stack supports, such as mice and keyboards, printers and mass storage and RNDIS devices.

“Making our solution available in tandem with Windows CE 5.0 will increase TransDimension’s visibility among ODMs that may adopt our USB controller to enable a variety of USB applications,” said Jim Gilbert, the company’s marketing director. “We look forward to expanding our relationship with Microsoft in the coming months by securing validation for some of our other innovative USB connectivity products, such as the TD1120, the industry’s first single-chip, USB On-the-Go controller that supports both high-speed peripheral and full-speed host functionality.”

The TD242LP enables products to operate as either a USB host or a USB peripheral and can perform both functions simultaneously, thereby enabling numerous low-power, mobile USB applications. The host controller in the TD242LP is a true transfer level controller that users can interface directly to most popular microprocessors. The active endpoint and transfer descriptors are located in the on-chip memory, thus significantly reducing processor overhead relative to any comparable product on the market.

About TransDimension

With headquarters in Irvine, TransDimension is a privately held company founded in 1997 to develop and market peripheral connectivity solutions. TransDimension’s product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity between a wide range of PC peripheral applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, to exchange data. TransDimension’s SoftConnex USB solutions provide the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at

Note to Editors: Product or service names mentioned herein are the trademarks of their respective owners.


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