Micron’s Multi-Chip Packages Provide Customers With Optimized Memory Solutions For TI’s OMAP35x Processors
Micron Extends Mobile MCP Line to New & More Diverse Markets
Boise, Idaho – Micron Technology, Inc., today announced the availability of its high-performance multi-chip package (MCP) solutions optimized to work seamlessly with Texas Instruments Incorporated’s (TI) OMAP35x applications processors. Micron’s broad portfolio of MCP solutions feature low-power Mobile DRAM and NAND technology that allow customers to mix and match memory densities, configurations and package options that best meets their design requirements. As part of its relationship with TI, Micron has committed to actively support new markets interested in this technology that go beyond mobile, providing proven MCP solutions to new applications in the automotive, consumer, embedded and medical markets.
“We have collaborated closely with TI on the technical demands of the processors to ensure our memory design and packaged offerings exceed our customers’ needs,” said Eric Spanneut, director of marketing for Micron’s mobile memory. “We’re able to offer unprecedented value to customers by being a turnkey solutions provider—not only do we manufacture and package every component in our MCP portfolio, but we also offer optimum technical support and software services.”
TI’s line of OMAP35x processors, based on the ARM® CortexTM-A8 core, is designed to support features such as graphics displays in navigation systems, medical imaging equipment or portable music players. With multimedia functionality at the heart of these applications, Micron’s NAND-based MCP solutions offer the storage performance and capacity requirements that customers demand. Additionally, the small form factor designs of Micron’s MCP solutions allow customers to keep space constraint concerns at bay, while the low-power 1.8-volt power supply of the NAND flash and the inherently low self refresh of the Mobile DRAM allow for extended battery life.
“We are committed to simplifying our customers’ design process, and Micron’s validated MCP solutions eliminate the need to qualify our processors with a memory vendor,” said Kevin Hawkins, OMAP35x marketing manager at TI. “Micron came to the table with a complete portfolio of high-performance, low-power MCP solutions that meet the needs of our growing customer base.”
Micron, TI and Gumstix: Working Together to Enable New and Unique Customer Applications
Gumstix, Inc., a joint customer of TI and Micron, has created a line of tiny open source Linux-based computers (smaller than a stick of gum) using TI’s OMAP35x applications processor and a Micron MCP solution. Gumstix’ Overo™ computers provide designers with a small form-factor platform enabling the development of low-power, high-performance multimedia content for consumer, industrial and embedded applications.
“We produce 100 percent of our Overo line with Micron memory,” said Dr. W.Gordon Kruberg, president and CEO for Gumstix. “In addition to providing us with a broad portfolio of MCP solutions from which to choose, Micron engineers have been responsive and great to work with, and the company has provided excellent lead times, which have enabled us to get our product into the hands of open source innovators very quickly.”
For additional information on Micron’s portfolio of MCP solutions, please visit www.micron.com/products/mcps/.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron’s common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com/.
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