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Semiconductors

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Semtech Neo-Iso™ Platform Now Features Next Generation Energy Harvesting Capability
Semtech Neo-Iso™ Platform Now Features Next Generation Energy Harvesting Capability
8/23/2016 12:01:52 PM
Semtech Corporation  (Nasdaq:  SMTC ), a leading supplier of analog and mixed-signal semiconductors, today announced the production release of the  TS13102  and  TS13103  solid state relays. These enhanced solid state relays expand the company’s  Neo-Iso™ product platform  and enable self-powered control systems in Internet of Things (IoT) applications, such as smart …
Linaro Announces First LTS Monarch Release of OpenDataPlane
8/18/2016 10:15:37 AM
Linaro Ltd, the collaborative engineering organization developing open-source software for its member companies, today announced the availability of the first Long Term Support (LTS) Monarch release of OpenDataPlane®. The OpenDataPlane project is an open-source, cross-platform set of application programming interfaces (APIs) for the networking Software Defined Data Plane.The …
Mentor Graphics Launches New Xpedition Enterprise Platform to Address Rigid-Flex and High-Speed Design Challenges
Mentor Graphics Launches New Xpedition Enterprise Platform to Address Rigid-Flex and High-Speed Design Challenges
8/15/2016 11:29:53 AM
Mentor Graphics Corporation (NASDAQ: MENT) today announced the first phase of the new Xpedition® printed circuit design (PCB) design flow to address the increasing complexity of today’s advanced systems designs. The increasing densities of electronics products are forcing companies to develop highly compact system designs with more functionality, and at lower costs. To …
NVIDIA CEO Delivers World’s First AI Supercomputer in a Box to OpenAI
NVIDIA CEO Delivers World’s First AI Supercomputer in a Box to OpenAI
8/15/2016 10:37:11 AM
The world’s leading non-profit artificial intelligence research team needs the world’s fastest AI system. That’s why NVIDIA CEO Jen-Hsun Huang last week hand-delivered the world’s first AI supercomputer in a box — our NVIDIA DGX-1 — to OpenAI in San Francisco. “I thought it was incredibly appropriate that the world’s first supercomputer dedicated to artificial …
Korean airports upgrade access control with CIPURSE™ based security
Korean airports upgrade access control with CIPURSE™ based security
8/12/2016 5:42:22 PM
All around the world, airports and aviation buildings are some of the most protected public environments. To further strengthen airport access control systems for its personnel, Korea Airports Corporation (KAC) has been implementing a new solution based on the CIPURSE™ security standard. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) supplies the security chips for the …
Kaynes Technology Implements Lean NPI Flow using Mentor Graphics Software
Kaynes Technology Implements Lean NPI Flow using Mentor Graphics Software
8/12/2016 5:39:01 PM
Mentor Graphics Corporation (NASDAQ: MENT) today announced that Kaynes Technology, a leading electronic manufacturing service (EMS) company based in Mysore, India,  has selected Mentor Graphics to provide a complete design-to-manufacturing solution comprising Mentor Graphics Xpedition® Enterprise ,   HyperLynx®, Valor® Process Preparation , Valor NPI and Valor Parts …
STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package
STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package
8/3/2016 10:00:00 AM
Geneva, August 3, 2016 – STMicroelectronics has introduced a portfolio of TO-220 FullPAK (TO-220FP) wide creepage power transistors, including the world’s first 1500V super-junction MOSFET in this new important arcing-resistant package.   The TO-220FP wide creepage package is ideal for the power transistors of open-frame power supplies commonly used in equipment such as …
STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package
STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package
8/3/2016 8:58:05 AM
STMicroelectronics has introduced the LDBL20 , a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.   The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by …
New 50 mm thyristor/diode modules address requirements of cost-sensitive applications
New 50 mm thyristor/diode modules address requirements of cost-sensitive applications
7/29/2016 9:22:56 AM
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) extends its product portfolio of thyristor/diode modules in solder bond technology with a 50 mm module. These bipolar modules address the growing market for cost-effective solutions even in demanding applications. Depending on the module, market prices are approximately 25 percent lower than comparable pressure contact …

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