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Semiconductors

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SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology
SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology
9/15/2017 3:31:14 AM
SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the qualification of 10nm Ultra-high Density wafer bumping for Qualcomm Technologies.
Afero® Launches Next Generation IoT Development Kit in Partnership with Semiconductor Leader Microchip
9/14/2017 12:23:16 PM
Afero, the next-generation IoT company with a fully integrated and highly secure edge-to-cloud platform, announced today the availability of the Afero Modulo-2™, an IoT development kit with secure connectivity, secure data, and a highly productive development environment.
600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives
600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives
9/14/2017 8:56:34 AM
Geneva, September 14, 2017 -- New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify assembly of motor drives from very low power up to 300W.
EEMBC Benchmark Verifies Energy Cost of Integrated Microcontroller Peripherals
9/12/2017 8:00:00 AM
EEMBC®, the industry-consortium setting the standard for valuable and practical embedded system benchmarks, today announced the availability of EEMBC ULPMark™-PeripheralProfile (ULPMark™-PP), a tool to measure the energy efficiency of microcontrollers (MCUs) and their commonly-used, programmable peripherals.
Samsung Strengthens Advanced Foundry Portfolio with New 11nm LPP and 7nm LPP with EUV Technology
Samsung Strengthens Advanced Foundry Portfolio with New 11nm LPP and 7nm LPP with EUV Technology
9/11/2017 11:19:57 AM
Samsung Electronics, the world leader in advanced semiconductor technology, today announced it has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with an even wider range of options for their next-generation products.
Linde LienHwa invests in local production of electronic materials at two Taiwan facilities
Linde LienHwa invests in local production of electronic materials at two Taiwan facilities
9/11/2017 11:11:51 AM
• C4 F8 (octafluorobutane) purification and filling facility in Taichung • HCDS (hexachlorodisilane) transfill facility in Guanyin Linde LienHwa, a member of The Linde Group and a leading supplier of gases and chemicals to the electronics industry, continues to invest in local production of electronic special gases (ESGs).
New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package
New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package
9/7/2017 9:15:16 AM
Geneva, September 7, 2017 – STMicroelectronics is extending choice and freedom for budget-conscious designers by introducing its new 8-bit STM8S001 microcontroller (MCU) in the economical SO-8 package.
Panasonic’s Smart Factory Solutions Realize Higher Productivity Using Network Technologies
Panasonic’s Smart Factory Solutions Realize Higher Productivity Using Network Technologies
9/7/2017 4:59:56 AM
Since its foundation, Panasonic has used its manufacturing technologies backed by its production know-how and expertise to spearhead the manufacturing equipment business, which includes mounters/welders and devices for electronic parts, semi-conductors, and displays.
Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects
Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects
9/6/2017 9:07:22 AM
Geneva, September 6, 2017 – To help product innovators streamline prototyping and development of connected smart objects, STMicroelectronics has created the SPBTLE-1S ready-to-use Bluetooth® Low Energy (BLE) module that integrates all the components needed to complete the radio subsystem.
Huawei Announces Peak Cell Throughput Exceeds 20 Gbit/s in C-Band Test of China’s 5G Technology R&D Trial
Huawei Announces Peak Cell Throughput Exceeds 20 Gbit/s in C-Band Test of China’s 5G Technology R&D Trial
9/4/2017 5:52:27 PM
Huawei announces that peak cell throughput has exceeded 20 Gbit/s to achieve a breakthrough in the C-Band test. This test procedure is an important part of the China 5G Technology Research and Development (R&D) Trial which is organized by the IMT-2020 (5G) Promotion Group.
Next-generation radiation-hardened computer for space
Next-generation radiation-hardened computer for space
8/24/2017 9:27:39 AM
BAE Systems, a world leader in radiation-hardened computers and processors for satellites and spacecraft, announced a new generation of its flagship space computer that combines fast performance and extreme resiliency to enable previously impossible missions in the harsh environment of space.
Intel Delivers ‘Real-Time AI’ in Microsoft’s New Accelerated Deep Learning Platform
Intel Delivers ‘Real-Time AI’ in Microsoft’s New Accelerated Deep Learning Platform
8/23/2017 12:33:56 PM
Artificial intelligence (AI) and deep learning (DL) promise to transform how people engage with the world and how businesses operate in order to make smarter decisions, and Intel® technology is enabling this transformation.
Stacy Smith to Retire after 30 Years at Intel
Stacy Smith to Retire after 30 Years at Intel
8/23/2017 8:15:43 AM
In an email today, Intel CEO Brian Krzanich announced that Stacy Smith, Group President of Manufacturing, Operations and Sales at Intel, has decided to retire from the company at the end of January 2018.

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