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Semiconductors

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Advanced IGBTs Optimized for Soft Switching Raise Induction-Heating Efficiency in Home Appliances
Advanced IGBTs Optimized for Soft Switching Raise Induction-Heating Efficiency in Home Appliances
3/18/2019 9:44:48 AM
Geneva, March 18, 2019 -- Optimized for best conduction and switching performance in soft-switching circuits, STMicroelectronics’ STGWA40IH65DF and STGWA50IH65DF 650V STPOWER™ IGBTs increase the energy efficiency of resonant converters in the 16kHz-60kHz switching-frequency range.
Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones
Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones
3/15/2019 3:18:22 PM
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile DRAM – the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) package – optimized for tomorrow’s premium smartphones.
Building-Integrated Photovoltaics Moves From the Niche to the Mass Market – Industrial Manufacture of Solar Building Components and Their Integration Into the Building Planning Process
Building-Integrated Photovoltaics Moves From the Niche to the Mass Market – Industrial Manufacture of Solar Building Components and Their Integration Into the Building Planning Process
3/15/2019 11:32:10 AM
The majority of photovoltaic (PV) systems in Germany are roof-mounted using a mounting system to fix the modules. On the other hand, solar PV modules that are fully integrated into the façade or roof offer many advantages to the building owner.
ZEISS Semiconductor Mask Solutions Receives Intel’s Preferred Quality Supplier Award
ZEISS Semiconductor Mask Solutions Receives Intel’s Preferred Quality Supplier Award
3/15/2019 3:36:53 AM
ZEISS Semiconductor Mask Solutions has been recognized by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like ZEISS that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.
Water-Resistant MEMS Pressure Sensor from STMicroelectronics Targets Budget-Conscious Consumer and Industrial Applications
Water-Resistant MEMS Pressure Sensor from STMicroelectronics Targets Budget-Conscious Consumer and Industrial Applications
3/12/2019 9:58:22 AM
Geneva, March 12, 2019 -- The STMicroelectronics LPS33W water-resistant MEMS pressure sensor combines chemical compatibility, stability, and accuracy for use in a wide range of applications such as fitness trackers and other wearables, vacuum cleaners, and general-purpose industrial sensing.
UMC Board of Directors Announces Proposals for its Annual Shareholders Meeting
UMC Board of Directors Announces Proposals for its Annual Shareholders Meeting
3/6/2019 2:23:50 PM
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), at a meeting of the Board of Directors held today, approved the 2018 Business Report and Financial Statements, and set the agenda for the Annual General Meeting.
MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts
MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts
3/6/2019 1:05:07 PM
MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands.  The collaboration will leverage GF’s 300mm silicon manufacturing …
Fujifilm is Breaking Ground to Expand its Electronic Materials Facility in Mesa, Arizona
Fujifilm is Breaking Ground to Expand its Electronic Materials Facility in Mesa, Arizona
3/1/2019 11:05:01 AM
Mesa, AZ, March 1, 2019 —FUJIFILM Electronic Materials U.S.A., Inc. (FEUS)  broke ground for a major expansion of its manufacturing and development facility in Mesa, Arizona.
AMD Drives High-Performance Computing for the Embedded Industry with New Customers, Growing Momentum and Broad Ecosystem Support
AMD Drives High-Performance Computing for the Embedded Industry with New Customers, Growing Momentum and Broad Ecosystem Support
2/27/2019 9:55:20 AM
AMD (NASDAQ: AMD) arrives at Embedded World 2019 riding a wave of success following the launch of its flagship AMD Ryzen™ Embedded V1000 and AMD EPYC™ Embedded 3000 processors in 2018 that have resulted in new and expanded partnerships with industry leaders like Advantech, Supermicro, Mentor, congatec, IEI, and more.
REAL3™ Time-of-Flight Image Sensor: Fourth Generation With HVGA Resolution for High Quality Photo Effects and More
REAL3™ Time-of-Flight Image Sensor: Fourth Generation With HVGA Resolution for High Quality Photo Effects and More
2/25/2019 10:52:22 AM
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain.
New STM32WB Dual-Core Wireless MCUs from STMicroelectronics Deliver Ultra-Low-Power Real-Time Performance
New STM32WB Dual-Core Wireless MCUs from STMicroelectronics Deliver Ultra-Low-Power Real-Time Performance
2/25/2019 9:59:46 AM
Geneva, February 25, 2019 -- STM32WBx5* dual-core wireless microcontrollers (MCU) from STMicroelectronics come with Bluetooth® 5, OpenThread, and ZigBee® 3.0** connectivity combined with ultra-low-power performance.
Tinier and less power-hungry quantum atomic clock push toward intelligent IoT
Tinier and less power-hungry quantum atomic clock push toward intelligent IoT
2/22/2019 1:03:28 PM
Scientists at Tokyo Institute of Technology, Ricoh co. and The National Institute of Advanced Industrial Science and Technology have developed an ultra-lowpower atomic clock (ULPAC) for small satellites to enable future communication systems beyond 5G.
KaiOS Technologies and MediaTek Collaborate to Deliver Affordable 3G/4G Smart Feature Phones
KaiOS Technologies and MediaTek Collaborate to Deliver Affordable 3G/4G Smart Feature Phones
2/22/2019 11:34:25 AM
MediaTek Inc., a global fabless semiconductor company, and KaiOS Technologies, maker of KaiOS, the emerging mobile operating system for smart feature phones, announced their collaboration to integrate KaiOS with a series of MediaTek chipsets to power 3G and 4G devices.
Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry’s First Automotive Grade 1 IP for 22FDX Process
Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry’s First Automotive Grade 1 IP for 22FDX Process
2/22/2019 10:49:12 AM
Highlights • Synopsys DesignWare IP for automotive Grade 1 and Grade 2 temperature operation on GLOBALFOUNDRIES 22FDX® process includes Logic Libraries, Embedded Memories, Data Converters, LPDDR4, PCI Express 3.1, USB 2.0/3.1, and MIPI D-PHY IP • Synopsys’ IP solutions implement additional automotive-grade design rules for the 22FDX process to meet reliability and …
STM32G0 Ecosystem Extensions from STMicroelectronics Support USB-C as Standard Interface on Conventional Microcontrollers
STM32G0 Ecosystem Extensions from STMicroelectronics Support USB-C as Standard Interface on Conventional Microcontrollers
2/22/2019 3:53:40 AM
Geneva, February 22, 2019 -- STMicroelectronics is shortening the learning curve for STM32G0* users to take advantage of the microcontrollers’ support for certified USB Type-C™ and the Power Delivery (PD) 3.0 protocol with the addition of new tools and capabilities to the STM32Cube ecosystem.
Secure-Element Evaluation Kit from STMicroelectronics Comes with Ready-to-Use Software for IT and IoT Applications
Secure-Element Evaluation Kit from STMicroelectronics Comes with Ready-to-Use Software for IT and IoT Applications
2/20/2019 3:38:44 AM
Geneva, February 20, 2019 -- STMicroelectronics’ STSAFE-A100 Evaluation Pack extends the richly supportive STM32 Nucleo ecosystem to accelerate secure-element integration, leveraging reusable source code that simplifies the creation of secure IoT devices, high-value consumables such as medical probes, IT accessories, and consumer products.

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