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Electronic Components

Releases published in the last 30 days. RSS 0.91 Feed

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IDT Offers Avalanche Technology’s MRAM Devices to Complement its Broad Range of Semiconductor Devices
IDT Offers Avalanche Technology’s MRAM Devices to Complement its Broad Range of Semiconductor Devices
10/18/2019 12:51:08 PM
Integrated Device Technology, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), today announced that it now offers Avalanche’s magnetic RAM (MRAM) devices to complement the extensive range of power, sensor, timing and microcontroller devices from Renesas.
Hitachi Automotive Systems Starts Mass Production of High Voltage and High Output EV Inverter, the First in the World
Hitachi Automotive Systems Starts Mass Production of High Voltage and High Output EV Inverter, the First in the World
10/18/2019 12:34:42 PM
Hitachi Automotive Systems, Ltd. today announced the start of mass production for their 800-volt compatible high voltage and high output electric vehicle (EV) inverter, which increases EV practicality and enables long-distance driving.
Epson Develops New 16-Bit Microcontroller with e-Paper Driver
Epson Develops New 16-Bit Microcontroller with e-Paper Driver
10/16/2019 8:39:34 AM
Seiko Epson Corporation (TSE: 6724, "Epson") has developed and begun shipping samples of the S1C17F63, a 16-bit microcontroller unit (MCU) with a built-in driver that is ideal for driving small e-paper displays.
Qualcomm Technologies to Enhance Secure Cellular Connectivity Solutions with Microsoft Azure Sphere for the IoT
Qualcomm Technologies to Enhance Secure Cellular Connectivity Solutions with Microsoft Azure Sphere for the IoT
10/15/2019 10:48:38 AM
Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, announced today at its 5G Summit in Barcelona, Spain that it is developing the first cellular chip optimized and certified for Microsoft’s Azure Sphere Internet of Things (IoT) operating system.
Film capacitors: Compact form factors for DC link applications
Film capacitors: Compact form factors for DC link applications
10/15/2019 9:07:43 AM
TDK Corporation (TSE:6762) has extended the portfolio of EPCOS film capacitors for DC link applications with the B3277*X/Y/Z series. The new capacitors feature compact dimensions, high capacitance density and high current capability.
AFL Issued 12 Patents for Technology and Product Development
AFL Issued 12 Patents for Technology and Product Development
10/14/2019 1:19:09 PM
AFL, an international manufacturer of fiber optic cable, accessories and equipment, received 12 patents over the past quarter for technology and product developments in fiber optic cabling, fusion splicing, test equipment  and connectivity.
Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich
Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich
10/10/2019 8:58:35 AM
Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled an expanded portfolio of cutting-edge foundry solutions at its Samsung Foundry Forum (SFF) 2019 Munich.
Acquisition of 100% of CSDC Private Limited (“CSDC”)
Acquisition of 100% of CSDC Private Limited (“CSDC”)
10/10/2019 8:40:58 AM
IQE plc (AIM: IQE) the leading supplier of advanced wafer products and material solutions to the semiconductor industry, announces the acquisition of third-party shareholdings in its CSDC joint venture in Singapore taking its ownership to 100%.
Bosch poised for leap in e-mobility technology
Bosch poised for leap in e-mobility technology
10/9/2019 5:49:44 AM
• Harald Kroeger: “Silicon carbide semiconductors bring more power to electric motors. For motorists, this means a 6 percent increase in range.” • Only Bosch is equally at home in the automotive and the semiconductor industries.
Advantest Issues Call for Papers for VOICE 2020 Developer Conference with Sessions in U.S. and China
Advantest Issues Call for Papers for VOICE 2020 Developer Conference with Sessions in U.S. and China
10/8/2019 11:57:11 AM
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has opened the call for papers for its international VOICE 2020 Developer Conference focusing on leading-edge technologies and future trends.
Syrma Technology Wins 2019 Electronics Maker Best of Industry Award
10/8/2019 10:00:00 AM
Syrma Technology, a leading electronic products and solutions provider, was recognized for their operations in India with the “Make in India Initiative” Award at the 2019 EM Best of Industry Awards, held in New Delhi by the leading technology magazine,  Electronics Maker.
LED Strip Light Application Ideas: How to Use LED Strip Lights
LED Strip Light Application Ideas: How to Use LED Strip Lights
10/5/2019 1:59:09 PM
LED strip lights are a hot selling LED product. LED tape lights are flexible, easy to install and they can decorate many kinds of furniture. Here is a list of where LED strip lights can be used.
Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core
Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core
10/2/2019 4:43:30 PM
What’s New: Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel’s unique processor, code-named “Lakefield,” that features an industry-first architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology.
Microchip Simplifies Hardware-Based IoT Security with the Industry’s First Pre-Provisioned Solutions for Deployments of Any Size
Microchip Simplifies Hardware-Based IoT Security with the Industry’s First Pre-Provisioned Solutions for Deployments of Any Size
10/1/2019 9:23:02 AM
As the number and types of connected devices proliferates, market fragmentation and security vulnerabilities in the Internet of Things (IoT) have created significant challenges for developers.
Mitsubishi Electric Develops Ultra-Wideband Transmission Chip Set for Multi-Purpose Wireless Systems
Mitsubishi Electric Develops Ultra-Wideband Transmission Chip Set for Multi-Purpose Wireless Systems
9/26/2019 10:03:17 AM
Mitsubishi Electric Corporation (TOKYO: 6503) announced today it has developed the world’s first* ultra-wideband transmission chip set with S/C/X-band capability, designed for multi-purpose wireless systems.
LANXESS inaugurates high-tech plastics plant in China
LANXESS inaugurates high-tech plastics plant in China
9/25/2019 9:43:21 AM
Specialty chemicals company LANXESS officially inaugurated its new plant in Changzhou, China, on September 25, 2019. The compounding facility produces Durethan- and Pocan-branded high-tech plastics, especially for the automotive sector and the electrical and electronics industry.
The Game Changer is here! Nichia launches world’s first 2-in-1 tunable white, single LES, mid-power 3030 LED!
The Game Changer is here! Nichia launches world’s first 2-in-1 tunable white, single LES, mid-power 3030 LED!
9/23/2019 11:12:44 AM
Nichia, the leader in and inventor of the high-brightness LED, announces its game-changing 2-in-1 tunable white LED. This is the industry’s first tunable white LED in a mid-power 3030 package with a single light emitting surface (LES).

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