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Electronic Components

Releases published in the last 30 days. RSS 0.91 Feed

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Epson to License SEGGER Microcontroller’s emWin for Its S1C31D01 Series Microcontrollers
Epson to License SEGGER Microcontroller’s emWin for Its S1C31D01 Series Microcontrollers
12/14/2017 12:12:35 PM
Seiko Epson Corporation (TSE: 6724, "Epson") and SEGGER Microcontroller GmbH & Co. KG ("SEGGER") today announced that Epson will start support and free of charge distribution of the emWin embedded GUI tool for Epson’s 32-bit flash memory embedded microcontroller S1C31D01.
Introducing the New Cleaner for Waterproof Optical Connector
Introducing the New Cleaner for Waterproof Optical Connector "NEOCLEAN-EZ1 Plus"
12/14/2017 10:46:32 AM
NTT Advanced Technology Corp. (hereafter: NTT-AT, head office: Kawasaki city, Kanagawa Prefecture, President: George Kimura) announces the sales release, starting on December 15, 2017, of its newest of the ‘NEOCLEAN Series’ of push type cleaners for SC, LC, MPO, etc., the "NEOCLEAN-EZ1 Plus for waterproof optical connectors (ODC connectors) used in FTTA (Fiber to the Antenna) …
Toyota and Panasonic to Start Feasibility Study of Joint Automotive Prismatic Battery Business
Toyota and Panasonic to Start Feasibility Study of Joint Automotive Prismatic Battery Business
12/13/2017 10:12:45 AM
Toyota Motor Corporation (Toyota) and Panasonic Corporation (Panasonic) announce today an agreement to begin studying the feasibility of a joint automotive prismatic battery business.
Apple awards Finisar $390 million from its Advanced Manufacturing Fund
Apple awards Finisar $390 million from its Advanced Manufacturing Fund
12/13/2017 9:59:47 AM
Apple today announced the latest award from its $1 billion Advanced Manufacturing Fund. Finisar, a leading manufacturer of optical communications components, will receive $390 million as part of Apple’s commitment to support innovation and job creation by American manufacturers.
Toshiba and Western Digital Reach Global Settlement and Agree to Strengthen Flash Memory Collaboration
Toshiba and Western Digital Reach Global Settlement and Agree to Strengthen Flash Memory Collaboration
12/13/2017 9:48:36 AM
Toshiba Corporation (TOKYO: 6502) (“Toshiba”), Toshiba Memory Corporation (“TMC”) and Western Digital Corporation (NASDAQ: WDC) (“Western Digital”) have entered into a global settlement agreement to resolve their ongoing disputes in litigation and arbitration, strengthen and extend their relationship, and enhance the mutual commitment to their ongoing flash memory …
Japan-Taiwan joint experiment successfully proves white-box based carrier-grade networking
Japan-Taiwan joint experiment successfully proves white-box based carrier-grade networking
12/13/2017 9:46:00 AM
Nippon Telegraph and Telephone Corporation (Headquartered in Chiyoda-ku, Tokyo, President and CEO Hiroo Unoura; NTT hereinafter) and Chunghwa Telecom (Headquartered in Xinyi Road, Zhongzheng District, Taipei City, Taiwan, CEO Yu Cheng; Chunghwa Telecom hereinafter) succeeded in a joint experiment to verify the service continuity and reliability required by telecommunications …
NEO Tech Design Team Wins Industry Award for Creative Solutions That Accelerate Time-to-Market
NEO Tech Design Team Wins Industry Award for Creative Solutions That Accelerate Time-to-Market
12/12/2017 12:00:00 PM
NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and aerospace & defense markets, announces that it earned an Annual Creativity in Electronics (ACE) Award for its innovations in the electronics industry that have improved time to market.
Introducing the New Intel Pentium Silver and Intel Celeron Processors: Performance and Connectivity at Amazing Value
Introducing the New Intel Pentium Silver and Intel Celeron Processors: Performance and Connectivity at Amazing Value
12/11/2017 1:19:50 PM
Intel delivers industry-leading innovations and creates new experiences across its portfolio products. Today, Intel unveils the all-new Intel Pentium® Silver and Intel Celeron® processors.
Fujitsu Technology Bonds Single-crystal Diamond and SiC at Room Temperature; Enables Boost to Radar Performance
Fujitsu Technology Bonds Single-crystal Diamond and SiC at Room Temperature; Enables Boost to Radar Performance
12/7/2017 2:56:49 PM
Fujitsu Laboratories Ltd.,Fujitsu Limited Fujitsu Limited and Fujitsu Laboratories Ltd. today announced development of the world’s first technology for bonding single-crystal diamond to a silicon carbide (SiC)( 1 )  substrate at room temperature.
Renesas Electronics and HELLA Aglaia Open Up the Front Camera Market with Open, Scalable ADAS Solution
Renesas Electronics and HELLA Aglaia Open Up the Front Camera Market with Open, Scalable ADAS Solution
12/5/2017 4:00:31 AM
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and HELLA Aglaia, one of the leading global developers of intelligent visual sensor systems, announced their open and scalable front camera solution for advanced driver assistance systems (ADAS) and automated driving.
GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications
GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications
12/4/2017 2:23:13 PM
 GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.
Renesas Electronics America Highlights End-to-End Solutions for the Internet of Medical Things at BIOMEDevice 2017
Renesas Electronics America Highlights End-to-End Solutions for the Internet of Medical Things at BIOMEDevice 2017
12/4/2017 2:20:06 PM
  Renesas Electronics America Inc., a premier supplier of advanced semiconductor solutions, today announced it will highlight design innovation for the Internet of Medical Things (IoMT) at  BIOMEDevice 2017.
Audi relies on Infineon: World’s first series production car with autonomous driving features
Audi relies on Infineon: World’s first series production car with autonomous driving features
12/4/2017 1:55:11 PM
Infineon supplies key components for the Audi A8, the world’s first series production car featuring level 3 automated driving. The ability of cars to self-drive is split into a number of different levels: With level 3 (see explanation below), drivers can temporarily take their hands off the steering wheel under certain conditions.
Allchips Holds Sharing Session “China’s Electronic Components Situation & AI Creatively Developing” at CHTF 2017
Allchips Holds Sharing Session “China’s Electronic Components Situation & AI Creatively Developing” at CHTF 2017
11/22/2017 9:55:48 AM
On Nov. 20, fifth day of the 19th China High-Tech Fair 2017, Allchips held the sharing session “China’s Electronic Components Situation & AI Creatively Developing.” In this session, challenges that traditional IC e-commerce faced, and new demands of products, services from IOT and AI companies have been discussed.

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