Electronic Components News and Press Releases

Electronic Components

Releases published in the last 30 days.

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CompoundTek Collaborates with Cadence and Lumerical to Deliver Integrated Electronic-Photonic Design Automation PDK for Silicon Photonics ICs: 12/12/2019 5:19:05 PM; CompoundTek, a global foundry services leader in emerging silicon photonic (SiPh) solutions, today announced that it has collaborated with Cadence Design Systems, Inc.
II-VI Incorporated Ranks First in Competitiveness for Optical Components in Global Markets at ODC 2019 Awards Ceremony in China: 12/12/2019 4:17:25 PM; II-VI Incorporated (Nasdaq: IIVI), a leading supplier of optoelectronic devices and micro-optics, today announced that it was twice recognized at a recent industry awards ceremony in China.
Western Digital’s WD Blue SN550 NVMe SSD Can Deliver up to 4x the Speed of SATA SSD for Tech Savvy Professionals: 12/12/2019 8:28:47 AM; Story Hightligths • The next-generation WD Blue® SN550 NVMe™ SSD is capable of being up to 4x faster than SATA SSDs, with read speeds up to 2,400 MB/s** for ultra-responsive PC performance • An improved thermal design helps maintain sustained performance during intense use Western Digital Corp.
Sumitomo Electric Launches Thunderbolt™ 3 Cables on Amazon Japan: 12/11/2019 1:42:01 PM; Thunderbolt™ is a fast general-purpose data transmission specification developed by Intel Corporation for data communications between a personal computer and peripheral devices such as a display.*1 Sumitomo Electric undertook the development of Thunderbolt™ cables based on technical specifications disclosed by Intel to Sumitomo Electric.
Western Digital Brings Memory Closer to Compute with New RISC-V Innovations and Strategic Partnerships: 12/11/2019 12:51:16 PM; Western Digital Corp. (NASDAQ: WDC) unveiled new innovations and ecosystem partnerships intended to foster collaborative innovation, and the development and commercialization of purpose-built technologies based on RISC-V.
TDK showcases record breadth of solutions for automotive, 5G, IoT, mobile, robotics, wearables and wellness at CES 2020: 12/11/2019 10:03:16 AM; • TDK Corporation will bring the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries to CES. The showcase will include the widest breath of products in the company’s history at any single show in North America.
Onkyo & Pioneer Corp. announces HDR10+ Firmware Update for UDP-LX800 and UDP-LX500 Universal Disc Players will be further delayed: 12/11/2019 9:51:33 AM; Onkyo & Pioneer Corp. regrets to inform its customers that a firmware update adding HDR10+ support to the UDP-LX800 and UDP-LX500 Universal Disc Players, previously announced in June 2019, will be further delayed due to an unavoidable slippage in the development schedule.
The 2020 Top Technology Trends in Power: 12/9/2019 4:47:47 PM; For the past several decades, the subject of ‘power’ has been consistently viewed as a challenge focused primarily on the incremental improvement – be that by technology, by government regulations, or by shifting consumer behavior.
ASM International to Host Technology Seminar: 12/6/2019 4:57:36 PM; ASM International N.V. (Euronext Amsterdam: ASM) today announces that it will host a technical luncheon seminar in San Francisco, CA, US, on Wednesday, December 11, 2019, the third day of the IEDM Conference.
Qualcomm Snapdragon Powered Always On, Always Connected PC Portfolio Expansion Disrupts Entry, Mainstream, and Premium Mobile PC Industries: 12/5/2019 5:41:26 PM; Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announces a broad Qualcomm® Snapdragon™ Compute platform portfolio with long battery life, cellular connectivity, and AI accelerated performance to enable fanless, thin and light designs for modern computing.
Advantest to Feature Latest Test Solutions for 5G, Automotive and IoT Applications at SEMICON Japan 2019: 12/4/2019 4:57:36 PM; Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will exhibit a wide variety of its latest products and solutions at SEMICON Japan 2019 on December 11-13 at Tokyo Big Sight.
International Planetarium Representatives Meet in Jena: 12/4/2019 6:17:24 AM; On occasion of the ZEISS Experience Days, the company presented its new ZEISS VELVET LED digital projector. Almost 100 planetarium representatives from the USA, South America, Malaysia, India and Europe traveled to the event at ZEISS’s own dome to obtain comprehensive information about the video projector with LED lighting.
Utilizing the Power of Scanning Acoustic Microscopy as a Tool for Failure Analysis, R&D and QC inspection to answer Manufacturing Questions: 12/3/2019 10:13:37 AM; In 1974, the first scanning acoustic microscope was developed at Stanford University. Since then, the technology has continued to advance and scanning acoustic microscopy has become an important tool used for failure analysis, non-destructive material testing and other investigations.
Blue Star Recyclers Unveils New Facility in Chicagoland: 12/3/2019 6:00:00 AM; With financial support provided by Mitsubishi Electric America Foundation, Blue Star Recyclers unveiled its first facility in Illinois on November 20, 2019.
What does ZEISS have to do with the Moon landing and microchips?: 11/20/2019 7:15:15 AM; The Long Night of the Sciences will once again be running 350 events at 65 locations to provide fascinating insights into what Jena has on offer in terms of the variety of science and research.
Rockwell Automation and Accenture Industry X.0 Combine Forces to Create Digital Solutions for Industrial Clients: 11/19/2019 3:31:52 PM; Today, Rockwell Automation, Inc (NYSE: ROK) and Accenture’s (NYSE: ACN) Industry X.0 announced plans to team up to develop a digital offering to help industrial clients move beyond existing manufacturing solutions to transform their entire connected enterprise.
Hitachi and Cambridge renew 30 year research partnership: 11/19/2019 8:37:15 AM; The University of Cambridge ("the University") and Hitachi, Ltd. (TSE: 6501, "Hitachi"), announced that they have signed a new agreement to continue and grow their long-standing relationship through the Hitachi Cambridge Laboratory (HCL), part of the European R&D Centre of Hitachi Europe Ltd., a wholly owned subsidiary of Hitachi.
AT&T Validates Qualcomm 9205 LTE Modem on Carrier’s Low-Power Wide-Area Networks: 11/18/2019 12:01:09 PM; Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced that AT&T has validated its Qualcomm® 9205 LTE multimode modem’s capabilities for the carrier’s LTE-M and NB-IoT networks.
Intel Board of Directors Elects New Director: 11/14/2019 6:15:46 PM; Intel Corporation today announced that James (Jim) J. Goetz was elected to Intel’s board of directors. His election marks the sixth new independent director added to Intel’s board since the beginning of 2016.
Telit’s simWISE Embedded SIM Technology Supports 5G-Ready LTE-M and NB-IoT Modules: 11/13/2019 9:11:57 AM; Innovative module-software embedded SIM technology expands from 2G to deliver simplification in logistics, lower costs and massive scalability to 4G cellular IoT Telit simWISE is an integral part of the company’s global connectivity offering and award winning Telit OneEdge suite of software, SaaS and PaaS, enabler of 5G-ready IoT at scale Telit, a global enabler of the …