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Henkel launches Loctite ABLESTIK CDF 900 series conductive die attach film
Henkel launches Loctite ABLESTIK CDF 900 series conductive die attach film
10/27/2026 11:02:16 AM
Henkel Adhesive Technologies has launched Loctite ABLESTIK CDF 900, its next-generation conductive die attach film (cDAF) series. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) …
General Compute Raises $100M Series A to Build the Inference Cloud for Ultra-Fast Tokens
General Compute Raises $100M Series A to Build the Inference Cloud for Ultra-Fast Tokens
10/27/2026 9:48:13 AM
General Compute, the world’s first heterogeneous inference cloud, today announced $100M in Series A funding co-led by Blackbird and Abstract, along with Fuse Venture Partners, Village Global, and others.
Hyperbolic Raises $30M to Build Liquidity and Orchestration Platform to Unify Global AI Compute
Hyperbolic Raises $30M to Build Liquidity and Orchestration Platform to Unify Global AI Compute
10/27/2026 9:19:10 AM
Hyperbolic, an AI infrastructure platform, today announced an oversubscribed $30M Series A1 funding round led by Walden Catalyst, the venture capital firm founded by Intel CEO Lip-Bu Tan and former Samsung Electronics Corporate President and CSO Young Sohn.

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