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Electronic Components

Releases published in the last 30 days. RSS 0.91 Feed

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ams OSRAM takes the stage at CES 2026 – Combining light, sensors and software to transform industries and improve lives
ams OSRAM takes the stage at CES 2026 – Combining light, sensors and software to transform industries and improve lives
1/6/2026 3:27:14 PM
• ams OSRAM will show more than a dozen interactive displays and immersive demonstrations of its latest LEDs, lasers, LED drivers and sensors in an exclusive meeting room at the Venetian Expo, January 6 – 9, 2026.
From Building Bricks to Brilliance: Model of Intel Series 3 Processor Steals the Show
From Building Bricks to Brilliance: Model of Intel Series 3 Processor Steals the Show
1/6/2026 1:00:32 PM
The mockup of an actual Intel® Core™ Ultra Series 3 (code-named Panther Lake) chip even lights up, thanks to 600+ LEDs and complicated circuitry hidden within its LEGO tiles – mimicking the way a real-life Series 3 processor functions.
3D Systems Accelerates Growth in Aerospace & Defense with Strategic Investments and Projected Leadership Position
3D Systems Accelerates Growth in Aerospace & Defense with Strategic Investments and Projected Leadership Position
1/5/2026 3:19:16 PM
3D Systems (NYSE: DDD), a leading provider of additive manufacturing solutions, today announced significant momentum in its Aerospace & Defense (A&D) business, including robust revenue growth projections, a major U.S.
World’s first 802.15.4ab-UWB chip verified by Calterah and Rohde & Schwarz to be demoed at CES 2026
World’s first 802.15.4ab-UWB chip verified by Calterah and Rohde & Schwarz to be demoed at CES 2026
1/5/2026 3:11:49 PM
Calterah, a global leader in chip design for CMOS single-chip millimeter-wave radar sensors, together with Rohde & Schwarz, a world-leading company in test and measurement, has successfully demonstrated its next-generation solution for digital car keys based on the Dubhe-UWB-SoC chip (Ultra-Wideband; System-on-Chip).
Infineon and Flex launch Zone Controller Development Kit for software-defined vehicles at CES 2026
Infineon and Flex launch Zone Controller Development Kit for software-defined vehicles at CES 2026
1/5/2026 10:16:25 AM
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Flex take the next step in their collaboration to accelerate the development of software-defined vehicles (SDVs).
SoftBank Corp., Ericsson, Qualcomm Technologies trial 5G and 5G Advanced capabilities including L4S on 5G SA commercial network
SoftBank Corp., Ericsson, Qualcomm Technologies trial 5G and 5G Advanced capabilities including L4S on 5G SA commercial network
12/26/2025 10:26:35 AM
SoftBank Corp. ("SoftBank") and Ericsson Japan K.K. ("Ericsson"), in collaboration with Qualcomm Technologies, Inc. ("Qualcomm Technologies"), have successfully conducted a field trial of low-latency communications using several 5G and 5G Advanced technologies – including Low Latency, Low Loss, and Scalable Throughput (L4S) – on SoftBank’s 5G Standalone (5G SA) commercial …
Endress+Hauser invests in Freiburg, Germany
Endress+Hauser invests in Freiburg, Germany
12/23/2025 5:39:22 PM
Over the next few years, Endress+Hauser will develop its own corporate campus in Freiburg, Germany. For this purpose, the Swiss specialist in measurement and automation technology has acquired a plot of land measuring about 20,000 square meters in the city’s Green Industry Park from a commercial real estate development agency (Freiburg-S-Wirtschaftsimmobilien GmbH & Co.
Rohde & Schwarz enhances New Zealand operations with opening of Auckland office
Rohde & Schwarz enhances New Zealand operations with opening of Auckland office
12/18/2025 8:58:15 PM
After more than 35 years of trusted partnership with Nichecom, Rohde & Schwarz has established a full-time footprint in New Zealand with the opening of a new sales office in Auckland on 15th November.
NHanced Leads the Industry in Hybrid Bonding Production
NHanced Leads the Industry in Hybrid Bonding Production
12/17/2025 12:05:09 PM
The company’s recently delivered Besi Datacon 8800 CHAMEOultra plus system is the world’s first operational advanced bonder of its kind to enter production NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, uniquely supports mixed-material hybrid bonding with either copper or nickel bonds.
RENA joins UK Government-funded consortium to strengthen national semiconductor metrology capabilities
RENA joins UK Government-funded consortium to strengthen national semiconductor metrology capabilities
12/17/2025 11:57:40 AM
RENA Technologies is proud to be a key industrial partner in a new 1.3 million euro government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT).
AI Accelerators Power Data Center IT Component to 40 Percent Growth in 3Q 2025, According to Dell’Oro Group
AI Accelerators Power Data Center IT Component to 40 Percent Growth in 3Q 2025, According to Dell’Oro Group
12/16/2025 11:14:28 PM
According to a recently published report by Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, global data center server and storage component revenue increased 40 percent year-over-year in 3Q 2025, driven primarily by strength in AI accelerators, which also lifted demand for complementary …
LUXEON® Versat 2016 Unleashes The Evolving Design Language of Today’s Most Advanced Vehicles
LUXEON® Versat 2016 Unleashes The Evolving Design Language of Today’s Most Advanced Vehicles
12/16/2025 10:33:08 PM
Lumileds ’ Versat 2016 is designed to address the necessary illumination specifications, reduce the engineering complexity and support the economic requirements for the growing segment of animated, personalized car-body lighting.

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