Intrinsyc Secures Fifth Soleus Win

Intrinsyc Software International, Inc. (TSX: ICS), a global wireless software solutions provider, today announced that it has secured a solution win for its Soleus software platform with a silicon provider. The agreement will see the Soleus mobile handset platform bundled with the silicon provider’s chips to provide a full high-level operating system (HLOS) solution. The Soleus-bundled chipsets are aimed to reach a variety of handset designers, enabling these manufacturers to achieve greater speed and flexibility in consumer multimedia wireless handset development. Intrinsyc is also providing engineering services to the silicon manufacturer to assist with various integration requirements. Financial terms of the agreement were not disclosed.

“As the first distribution deal with a silicon vendor, this agreement marks a major milestone for the Soleus software platform,” said Mark Johnston, Executive Vice President and General Manager, Worldwide Sales and Business Development, Intrinsyc Software. “By bundling Intrinsyc’s Soleus software with its chipsets, this manufacturer can offer a complete HLOS solution for consumer handset designers of any tier, which in turn could lead to an increase in the addressable market for the Soleus platform. The benefits of Soleus to Original Equipment Manufacturers (OEMs) and Original Design Manufacturers (ODMs) of handheld devices are clear – lower system design and engineering costs, faster time to market, and increased flexibility in customizing interfaces for specific consumer markets or network operators.”

Soleus is a complete handheld software platform, with pre-certified telephony and a large application portfolio, which enables handset manufacturers to rapidly develop and deploy an array of wireless consumer devices. The intuitive Soleus User Interface (UI) Framework provides a rich development environment that enables device makers to quickly customize devices to meet operator handset requirements.