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Rilperm® 5031: Arkema innovates in multilayer structures for fuel lines


Arkema is enhancing its Rilperm® range with the launch of a new patented system: Rilperm® 5031. This new solution for the first time uses a polyamide 6 alloy in the core layer, Orgalloy®, particularly conductive and cost-efficient.

This new 5-layer Rilperm® 5031 structure combines Rilsan® polyamide 12 (outer layer) - Orgalloy® (binder or tie layer) - Soarnol® EVOH, and Orgalloy® (barrier effect), thereby offering a genuine opportunity in terms of cost reduction, comparable to existing monolayer solutions.

Rilperm® 5031 is a remarkable electroconductor. With a surface resistivity of below 106 öhm / m2, it fulfills the conductivity requirements of American carmakers in terms of applications in contact with fuel (SAE(2) J 1645 standard).

Another benefit of Rilperm® 5031 structures is their twin barrier, Soarnol® (EVOH) and Orgalloy®, which imparts a very low fuel permeability to multilayer structures (with its chemical and thermal stability, Orgalloy® is particularly suited to the constraints of lasting contact with fuel).

Thanks to its design and the performance of its component materials, Rilperm® 5031 features outstanding impact resistance. This multilayer structure system fulfills the most stringent specifications in terms of cold impact.

With its wide-ranging properties, Rilperm® 5031 meets the automotive industry’s constraints in terms of safety, high technology, cost control, and environmental impact.

In addition to this latest grade, Arkema is pursuing its multilayer grade development, with the development of other systems at an advanced stage.


(1)Rilperm®, Rilsan® and Orgalloy® are Arkema registered trademarks
(2)Soarnol® is a Nippon Gosei trademark
(3)SAE = Society of Automotive Engineers
With worldwide trademarks like Rilsan® and Pebax®, unique products like Rilsan® PA11, and leading capacities in Rilsan® PA12, Arkema offers its customers key differentiations. Additionally, Arkema’s customers can be assured of superior technical and logistical support thanks to the Company’s production facilities and R&D centers in Europe, Asia and the US.


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