Northrop Grumman Advances Microchip Tech with Diamond Cooling Innovation

Summary

Northrop Grumman won a $7 million DARPA contract to build microchips cooled by diamond. The chips dissipate heat much better, so defense and space equipment can be smaller, lighter, faster and last longer.

• Diamond cooling lets microchips shed heat fast, allowing the chip to run faster, deliver stronger signals, and extend its lifespan.
  
  
• These chips and technologies are available nationwide across the industry, thanks to Northrop Grumman’s open access commitment.
  
  

Northrop Grumman (NYSE: NOC) is pioneering a new wave of microelectronics with a $7 million contract to create diamond-cooled chips that deliver higher power, faster speeds and dramatically enhanced performance for military radar and communications. The award marks Phase 2 of DARPA’s Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program, a pivotal effort to integrate diamond-based heat-dissipation technology into next-generation semiconductors, unlocking a new era for defense-grade chips.

Why This Matters:

• Heat threatens modern RF electronics. Today, RF systems operate well below their limits to prevent overheating, which reduces power, shortens chip life and increases the risk of circuit failure in demanding missions.
  
  
• Diamonds extract heat better than any other material. Diamond conducts heat five times faster than copper and far outperforms silicon carbide and gallium nitride, which are used today for high-performance applications. A diamond cooled‑ chip spreads heat more efficiently, letting it run longer without overheating.
• Power density could jump tenfold. Power density — how much power can fit into a tiny footprint — is vital for next-generation electronics. In DARPA THREADS Phase 1, Northrop Grumman boosted power by 3.3×; Phase 2 will push it further, delivering far stronger RF transmitters for military communications and satellite links.
  
  

Expert:

Ben Heying, director of microelectronics at Northrop Grumman’s Space Park Foundry: “Temperature has long capped what microelectronics can do, even Gallium Nitride (GaN), which is a standard today. Embedding diamond directly into chips works like a turbocharged cooling system. It keeps the chips cool so we can crank up the power without risk of burnout. This breakthrough lets Northrop Grumman’s diamond-cooled chips push beyond traditional heat limits and unlocks a new generation of fast, reliable RF electronics.”

Details:

At the company’s Microelectronics Center, microscopic diamonds are added directly into chips, removing heat away from radio frequency (RF) circuits. Northrop Grumman recently completed successful high-power tests using diamond as a semiconductor material, verifying diamonds are key to the future of semiconductor solutions. This innovative breakthrough keeps the devices cooler, boosts their speed and reliability, and allows them to handle higher power levels without throttling, ultimately delivering faster, more dependable performance for critical military systems.

Drawing on the company’s open access business model‑, Northrop Grumman partnered with Stanford University to embed diamond by growing a layer on the backside of the device within its microscopic channels. The diamond-filled channels transfer heat away from hotspots, keeping the device cool even at maximum power.

In Phase 2, Northrop Grumman plans to make these diamond-enhanced chips over three times more powerful, delivering more capability while taking up less space. This exponential leap will unlock far stronger RF transmitters, enhancing military communications, next-generation satellite links, and a broad spectrum of future applications.

The ambitious Phase 2 goal — tripling power density once again — is not an isolated milestone; it is the natural outcome of Northrop Grumman’s diamond technology research and investment, started in 2019. By capitalizing on diamond’s unrivaled heat-conductivity and its ability to endure extreme temperatures, the company has turned a research breakthrough into a strategic advantage, paving the way for the next generation of high-power, mission-critical semiconductors.

Northrop Grumman designs, manufactures, assembles, tests and packages millions of microelectronics annually to support next-generation defense and commercial systems in the United States, ensuring the American supply chain is protected and sustainable to strengthen our nation’s manufacturing infrastructure. From design, fabrication, to field, the company’s mission-tailored semiconductor solutions serve as the crucial intelligence powering mission success.

Northrop Grumman is a leading global aerospace and defense technology company. Our pioneering solutions equip our customers with the capabilities they need to connect and protect the world and push the boundaries of human exploration across the universe. Driven by a shared purpose to solve our customers’ toughest problems, our employees define possible every day.