Henkel launches first product of next generation thermal gap filler range for automotive applications

As vehicles become increasingly connected and driving is transformed by sophisticated ADAS and autonomous driving technologies, OEMs and component suppliers are increasingly challenged to manage the heat produced by ECU and ADAS components to ensure their performance and reliability. At the same time, there is a need to produce these components more cost-effectively, more sustainably, and with ever higher performance.

With its next generation of thermal gap fillers, Henkel Adhesive Technologies is helping to meet these intersecting challenges through innovative solutions tailored specifically for demanding automotive applications. Henkel is launching its next-generation range of thermal gap fillers with the offering of Bergquist gap filler TGF 4400LVO. Optimised to be dispensed with a thinner bond line and for fast processing and high reliability, and ideal for applications such as control units and ADAS components Bergquist gap filler TGF 4400LVO is a 2-component, room temperature curable gap filler based on low volatile silicone technology.

“As an expert partner to the automotive industry, we are working closely with OEMs and component manufacturers to develop new thermal interface materials and adhesives that meet the demands of the toughest, safety critical applications while improving efficiency and versatility,” said YM Bae, Business Development Manager at Henkel. “Our latest generation of gap fillers deliver a peerless combination of robust dispensing, high reliability, and a variety of thermal conductivity options. The launch of Bergquist gap filler TGF 4400LVO will be followed by further products that will address the broad scope of evolving requirements in automotive manufacture.”

Bergquist gap filler TGF 4400LVO provides an easily dispensed gap filler solution with a thin bond line that offers a high level of reliability in the face of thermal shock. It has a typical thermal conductivity of 4.4W/mK, and with a very low volatile siloxane content, provides a more sustainable choice that helps protect sensitive electronic components.

In a production environment, the fast-dispensing filler delivers greater efficiency and versatility. The long working time of more than 90 minutes also enables a wider process window and provides for sustainability benefits of reduced production line wastage. TGF 4400LVO cures at room temperature in 12 hours but curing can be accelerated with heat if required.