TDK SmartSound™ T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available

• T5838 and T5837 PDM microphones offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode
• SmartSound One provides a plug-and-play evaluation interface for Digital I²S and PDM and Analog MEMS Microphones

TDK Corporation (TSE:6762) announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform. These MEMS microphones push the boundaries of microphone acoustic performance, power efficiency, and advanced feature sets all in small package footprints. SmartSound One offers a solder-free, plug-and-play interface to evaluate and develop multiple types and configurations of microphones.

The T5837 and T5838 PDM MEMS microphones offer the world’s lowest power Pulse Density Modulation (PDM) multi-mode MEMS microphone with high acoustic overload point (AOP) of 133 dB SPL, high signal-to-noise ratio (SNR) 68 dBA, and wide dynamic range ideal for environments that shift from very quiet to very loud, such as far field voice pickup for smart speaker to ANC TWS applications.

• T5837, a very low power wide dynamic range PDM digital microphone with industry standard features:
  
  1. Multiple modes of operation such as high quality, low-power (Always On), ultrasonic, and sleep mode
  2. High quality mode offers an SNR of 68 dBA while only consuming 310 µA of supply current at 1.8V
  3. Low-power (Always On) mode offers an SNR of 65.5 dBA while only consuming 120 µA of supply current at 1.8V
  4. Targeted to smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, and security and surveillance market
  
  
• T5838, a very low power wide dynamic range PDM digital microphone with new acoustic activity detect (AAD) features:

1. Industry-leading acoustic performance, modes of operations, and low current draw as seen on the T5837
2. Acoustic activity detect (AAD), a new ultra-low power edge processing feature where the microphone monitors the acoustic environment and when activity is detected, can wake up the main SoC or application processor out of a deep power down mode. This can maximize system battery life. The AAD is available with three modes of operation starting at just 20 µA, providing user programmability for various filters and thresholds to optimize performance for each application
3. Targeted to smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, security and surveillance markets, high-end voice activated remote controls, and voice-activated equipment

T5838 and T5837 are available in small 3.5 × 2.65 × 0.98 mm bottom port packaging. For more information visit https://invensense.tdk.com/smartsound/

SmartSound One is a USB plug-and-play microphone interface module that enables rapid evaluation and development of TDK Analog and Digital MEMS microphone solutions. Users can plug in up to two microphones to transmit high quality stereo audio using standard audio packets over the USB connection and can capture this audio using their favorite software for later playback or detailed real-time analysis.

The SmartSound One is compatible with PDM digital, I²S digital, single-ended analog, and differential analog TDK microphones supplied on a flexible PCB.

T5838 and T5837 are available in small 3.5 × 2.65 × 0.98 mm bottom port packaging. For more information visit https://invensense.tdk.com/products/smartsound-one/

Flex Part Number      -      Output Type       -      Microphone

EV_T5837-FX2                Digital PDM                      T5837
EV_T5838-FX2                Digital PDM                      T5838
EV_T5848-FX2                Digital I²S                          T5848
EV_T3902-FX2                Digital PDM                       T3902
EV_ICS-40720-FX2         Analog Differential           ICS-40720
EV_ICS-40800-FX2         Analog Single-Ended       ICS-40800

• TWS: True wireless stereo
• HQM: High quality mode
• LPM: Low power mode
• AOP: Acoustic overload point
• SNR: Signal to noise ratio
• SPL: Sound pressure level
• AAD: Acoustic activity detect
• PDM: Pulse density modulation

• TWS: True wireless stereo
• HQM: High quality mode
• LPM: Low power mode
• AOP: Acoustic overload point
• SNR: Signal to noise ratio
• SPL: Sound pressure level
• AAD: Acoustic activity detect
• PDM: Pulse density modulation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK‘s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2022, TDK posted total sales of USD 15.6 billion and employed about 117,000 people worldwide.

InvenSense, a TDK Group company, is a world-leading provider of Sensing Solutions. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.

You can download this text and associated images at https://invensense.tdk.com/CES2023PR_SmartSound/