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Focused Ion Beam (FIB) Sectioning with SEM/TEM Analysis Provides Subsurface Analysis and Insight for Manufacturers and Semiconductor Fabricators

Advanced MicroAnalytical provides material analysis utilizing focused ion beam scanning electron microscopy (FIB-SEM) and other advanced material testing techniques to provide precise answers to clients’ exacting questions.


Salem, NH – WEBWIRE

In recent years, dual beam FIB-FESEM instruments have gained increasing adoption in manufacturing, process development and failure analysis due to their exceptional versatility and precision. The use of a focused ion beam (FIB) creates a very finely focused beam of ions from a reservoir source that can be rastered, focused and controlled with electrostatic deflectors and lenses.

The ions can be scanned over a sample surface to image the material with secondary electron generation, similar to an SEM. However, the larger mass of the ions impacts the surface with a much larger amount of energy than electrons from an SEM source. This provides a means by which a sample can be altered, shaped, prepared and then analyzed for a host of purposes. For example, samples can be cut, cross-sections can be created, and through the use of injected gas precursors, materials can be deposited on a sample to create controlled structures or create patterned conductive paths to edit or alter micro-circuitry.

The addition of a high resolution SEM column along with the FIB creates a truly powerful analytical platform. Samples can be mounted, sectioned, probed and imaged all in a very rapid, precise analytical time frame. The advantage of high magnification of the FESEM, good material contrast and low voltage imaging performance allows for very fine structures in composite materials to be examined. The electron beam also permits for the use of additional analytical techniques, such as EDS, EBSD and BSE imaging.

In addition, this exceptional imaging precision allows for easy preparation of extremely thin, precise TEM section samples in a variety of materials. All of these techniques can be combined to provide three dimensional analysis, using serial tomography sectioning with the high resolution ion beam, in order to provide voxel resolution under 10 nm over a large volume.

To learn more about FIB-SEM or other material, research and development, product viability or quality control testing and support services provided by Advanced MicroAnalytical, please visit www.AdvancedMicroAnalytical.com , call (877) 605-6662 or email  info@AdvancedMicroAnalytical.com .

About Advanced MicroAnalytical
At Advanced MicroAnalytical we are dedicated to providing you and your business with critical insight and knowledge that is essential in the modern era. We provide the testing services and analytical tools for comprehensive understanding of your materials and projects. Our services range from advanced microanalysis of nanotechnology to compositional and functional analysis of large manufactured systems.  Our laboratory services span a wide range of industries, including manufacturing, micro-electronics, nanofabrication, aerospace and defense, environmental engineering – as well as many others. Advanced MicroAnalytical is committed to serving as a valued analytical partner to our clients. We offer unmatched analysis, testing, and services to assist you in your business, environmental, and research challenges. Visit our website at www.advancedmicroanalytical.com.


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 Dual Beam Fib-fesem
 Manufacturing
 Failure Analysis
 Research And Development
 Quality Control Testing


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