Honeywell Develops Lead-Free Thermal Management Material for Semiconductors
Improved thermal material significantly decreases use of lead in semiconductor- power/discrete devices, helping to meet growing demand for more environmentally friendly solutions
MORRIS TOWNSHIP, N.J.- Honeywell (NYSE: HON) announced today that it has developed a new lead-free packaging technology that improves the thermal management of semiconductor chips.
The new product, called Honeywell Pb-free Die Attach Solder, is a lead-free thermal interface material that effectively manages the tremendous heat produced by semiconductor chips in order to improve chip reliability.
“Honeywell has been developing lead-free die attach solder alloys for many years to meet the industry’s ‘green’ requirements that emerged with the use of lead-free solder at the circuit board level,” said Scott Miller, metals product line manager for Honeywell Electronic Materials. “Our newest alloys will replace the high-lead alloys and provide better thermal management than other proposed lead-free thermal management alternatives such as polymer-based materials.”
As semiconductors become more powerful and smaller, more heat is being generated in a confined space when semiconductors are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell’s thermal management materials are designed to help the semiconductor packaging industry dissipate this heat by filling the gap between the semiconductor and the heat spreader.
Demand for lead-free solders is growing, driven in part by regulation. Honeywell’s new Pb-free Die Attach Solder is an advanced technology that is not only better for the environment, but is also cost effective. Lead-based solders are currently used for power/discrete die attach because they have a very good combination of melting temperature, wetting behavior, and mechanical properties. The new lead-free solder alloys are designed to meet these requirements, particularly resistance to melting during board level solder reflow.
Targeting the semiconductor industry’s power device segment, Pb-free Die Attach Solder will be used in chips that service a wide range of industries, from automotives to cell phones.
The lead free material is based on Honeywell’s metallurgical expertise and long experience as a supplier of die-attach solders. Honeywell Pb-free Die Attach Solder is designed to be used mainly in wire form and compliments Honeywell’s large diameter aluminum wire products. It provides power device manufacturers with a lower cost, more effective and greener alternative.
Honeywell Electronic Materials, part of Honeywell Specialty Materials, supplies microelectronic polymers, electronic chemicals, and other advanced materials that enable the integration of cutting edge processes at customer sites. Honeywell also maintains extensive product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples and materials used during back-end packaging processes for thermal management and electrical interconnect. More information can be found at http://www.honeywell.com/em/.
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