Agilent Technologies to Debut New Line-up of Manufacturing Test Products at 2008 APEX Conference
Agilent Technologies Inc. (NYSE: A) today announced that it will demonstrate its latest manufacturing test solutions at the 2008 APEX Conference and Exhibition in Las Vegas April 1-3, Booth 1735.
“In the near future, the market will likely witness growth in high-speed differential signaling with shrinking components and lack of accessible nodes,” said NK Chari, marketing director for Agilent’s Measurement Systems Division. "Designers and manufacturers will be challenged, as some of their current generation of solutions may not meet these needs.
“At APEX 2008, we will showcase our latest innovations toward solving these limited-access test challenges,” he added. “Agilent is committed to creating technology differentiators that can help manufacturers gain faster and better test access and defects coverage, while at the same time providing better ROIC for them.”
Agilent will showcase the following products at APEX:
* new powered vectorless test capabilities for in-circuit test;
* flexible and cost-effective automated optical inspection;
* the industry’s most accurate solder paste inspection system;
* 3-D X-ray inspection at in-line speeds;
* powerful process control software tools; and
* low cost in-circuit test.
New Powered Vectorless Test Capabilities for In-Circuit Test
Agilent’s VTEP v2.0 Powered with Cover-Extend Technology is an innovative way for i3070 in-circuit test users to test their printed circuit board assemblies in a limited access environment, without sacrificing test coverage or time-to-market -- while simultaneously saving on fixture cost and reducing test resources.
The technology is a hybrid of two established methodologies in electronic manufacturing test environment: Boundary Scan and VTEP vectorless testing. The result is a tool that combines the standardized, limited access, digital stimulus capability of Boundary Scan with the vectorless simplicity of VTEP.
Flexible and Cost-Effective Automated Optical Inspection
Agilent’s new Medalist sj5000 Automated Optical Inspection (AOI) platform includes new software features to extend its inspection capabilities. The sj5000 is one of the most flexible AOI systems in the industry and can be deployed easily into various SMT line configurations.
The sj5000 platform comes with a 4-mega-pixel, 60 fps inspection system, with scalability from 11-21 microns per pixel resolution, and a multi-colored structured LED light source. Inspection capability is enhanced through a new precision linear gantry, with 1-micron resolution and the latest inspection algorithms.
Industry’s Most Accurate Solder Paste Inspection System
The Agilent Medalist SP50 high-speed solder paste inspection system provides automated 3-D paste inspection for process characterization and defect prevention. It provides critical volume and location information at the most cost-effective process step: before solder reflow. Measurement data combined with statistical tools provides users with real-time process control.
3-D X-ray Inspection at In-Line Speeds
The Agilent Medalist x6000 automated X-ray inspection system offers extensive simultaneous 3-D X-ray inspection of double-sided panels at throughput rates that match most line rates of medium- to high-complexity printed circuit board assemblies (PCBA). It provides coverage for up to 95 percent of all manufacturing defects and is designed for PCBAs built with either lead or lead-free solder.
Users can quickly complete program development on the x6000 while benefiting from high test coverage, low false-call rate and fast cycle time.
Powerful Process Control Software Tools
Designed to make closed loop and defect prevention a reality, Agilent Process Control Software improves production quality by closing the loop between manufacturing and test. When used with pre- and post-reflow optical inspection systems, the software supplies users at all levels of the manufacturing organization with relative data to help them make more informed decisions, resulting in an improved production process.
Low Cost In-Circuit Test
The Agilent Medalist i1000 in-circuit test system can help manufacturers lower the overall cost of test. The i1000 reduces the cost of ownership with less expensive fixtures, shorter test-development times and lower up-front capital expenses. Test effectiveness and coverage on the i1000 is enhanced with Medalist VTEP v2.0 vectorless test.
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