Joint sales and distribution agreement of Electronic Materials for ‘Wafer Level Packaging’
Joint Press Release by BASF Aktiengesellschaft, Ludwigshafen, Germany and Dynaloy LLC, Indianapolis, USA
02/14/07 - Dynaloy LLC (Indianapolis, USA) and BASF AG (Ludwigshafen, Germany) announced today that they have entered into an expanded sales and distribution agreement for strippers and cleaners used in the IC (integrated circuit) industry for wafer level packaging and bumping steps. This agreement will enrich BASF’s product portfolio for the semiconductor industry and will give Dynaloy access to key markets in Asia and Europe.
The new agreement is a further step in BASF’s expanding activities in the electronic materials markets. It targets the area of wafer level packaging, which is one of the final steps in microchip production that uses contact pads rather than pins or wires to connect integrated circuits. Dynaloy has developed a broad portfolio of innovative and specialized chemical formulations for this process.
“With Dynaloy, BASF has a partner that can adjust its product offering to the ever changing requirements of the industry and is able to customize products to meet the latest requirements,“ said Dr. Karl-Rudolf Kurtz, Group Vice President of BASF’s Global Business Unit Electronic Materials. Donn Detzler, President of Dynaloy added: “BASF is the ideal partner for Dynaloy to provide the necessary technical support associated with our products with fast response to customer issues due to local presence and lab capabilities.“
BASF has a long-standing experience in the area of high purity chemicals and tailor-made formulations for the semiconductor and flat panel display industry. Dynaloy has advanced technology and specific products in the field of wafer level packaging.
BASF is the world’s leading chemical company: The Chemical Company. Its portfolio ranges from chemicals, plastics, performance products, agricultural products and fine chemicals to crude oil and natural gas. As a reliable partner to virtually all industries, BASF’s intelligent system solutions and high-value products help its customers to be more successful. BASF develops new technologies and uses them to open up additional market opportunities. It combines economic success with environmental protection and social responsibility, thus contributing to a better future. BASF has over 95,000 employees and posted sales of more than €42.7 billion in 2005. BASF shares are traded on the stock exchanges in Frankfurt (BAS), London (BFA), New York (BF) and Zurich (AN). Further information on BASF is available on the Internet at www.basf.com.
With over of 40 years of experience in polymer removal applications for the electronics and micro-electronics industry, Dynaloy has recently focused its efforts to become the industry market leader in the field of thick film resist removal. Heavily biased toward R&D, Dynaloy is continually developing next generation materials for tomorrow’s photo-resist removal challenges. With production capabilities in the US and Asia, combined with strong regional partnerships, Dynaloy is positioned to respond rapidly to changing industry needs, around the globe. Dynaloy is a privately held company under the E&A Industries corporate umbrella. Further information is available via the Dynaloy web-site at www.dynaloy.com.
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