SiBEAM Announces Revolutionary Snap Wireless Connector Technology
World’s First Single-chip Solution Features Ultra High-bandwidth Link to Wirelessly Replace Physical Connectors
SiBEAM, a pioneer and leader in millimeter wave technologies for wireless communications, today announced SiBEAM Snap™ wireless connector technology that will not only transform how consumers connect their devices, but will enable thinner and more robust mobile devices.
Consumers today use their mobile devices everywhere and expect those devices to have stunning designs and protected from everyday mishaps such as spilled coffee in the office or water damage on the ski slope. While wireless technologies such as LTE, Wi-Fi, Bluetooth, WirelessHD®, and wireless charging have provided consumers the freedom to use their mobile device anywhere, physical connectors continue to limit device robustness and industrial design.
Revolutionary SiBEAM Snap technology has been architected to replace physical connectors on a wide variety of devices including smartphones, tablets, 2-in-1 laptops, action cameras, wireless docks, and point-of-sales (POS) kiosks. By replacing physical connectors with SiBEAM Snap wireless connectors, device manufacturers are liberated to design more elegant devices for consumers that are completely wireless, thinner, lighter and better protected from damage caused by water, mud, and dust.
SiBEAM Snap technology is an ideal enhancement to wireless power or wireless charging that is rapidly becoming an essential feature in smartphones and tablets. When combined with wireless charging, SiBEAM Snap technology can completely replace the USB, HDMI, or DisplayPort connectors for data and video transfers and power charge, allowing for a truly connector-free mobile device.
SiBEAM is announcing its first two Snap single-chip integrated circuit (IC) solutions – the SB6212 Snap transmitter and SB6213 Snap receiver – designed to replace any USB 2.0 or USB 3.0 connector and deliver up to 12Gb/s of bi-directional throughput wirelessly, providing the bandwidth for high-speed video and data transfer.
“As a leader in wireless power, IDT delivers ultra-compact semiconductors that enable our customers to develop sleek consumer devices with ever-shrinking form factors,” said Majid Kafi, senior marketing director of IDT’s Analog and Power Division. “SiBEAM shares our vision of a wireless world, and we look forward to collaborate on innovations like its Snap technology to expand the wireless ecosystem.”
“Snap technology demonstrates SiBEAM’s commitment to innovate in the connectivity space, revolutionizing the mobile landscape with a true wireless connector solution,” said David Kuo, senior director of marketing at SiBEAM, Inc. “Snap technology leverages our proven millimeter wave technology expertise that frees designers from all mechanical constraints of connectors, allowing for a new class of thinner, more functional, and elegant mobile devices.”
Key Features and Benefits of SiBEAM Snap Technology:
- Secure, bi-directional ultra-high bandwidth wireless link
- Up to 12Gb/s for high-speed data transfers and 4K Ultra HD video streaming
- Replaces physical data and video connectors, including all variations of USB 2.0, USB 3.0, HDMI, and DisplayPort connectors
- Concurrent low-speed data tunneling for communication and control
- Software-driver free
- Elegant industrial design – enables a truly wireless device with uncompromised designs
- Multi-gigabit speed – aligns with current and next-generation connector speeds
- Freedom – allows for more durable, rugged and life proof devices that can go anywhere
- Eliminates signal integrity and EMI design complexities that comes with ultra-high bandwidth physical connectors
Key Features of the SB6212 and the SB6213:
- Single-chip solution supports USB 2.0, USB 3.0, and I2C interfaces
- Can replace USB Type A, Type B, Type C, and Micro USB connectors
SiBEAM at the 2015 International CES – Las Vegas, Nevada
SiBEAM will be showcasing its Snap technology by invitation only at Silicon Image’s demo suite in the Meeting Place #MP25877, South Hall of the Las Vegas Convention Center during the 2015 International CES from Tuesday, January 6, 2015 thru Friday, January 9, 2015.
About SiBEAM, Inc.
SiBEAM is a pioneer in developing intelligent millimeter wave technologies for wireless communications. The company was the first to build 60GHz chipsets using standard CMOS technology. SiBEAM is a global leader in driving next-generation architecture and semiconductor implementation of wireless connectivity solutions in the consumer electronics, mobile, enterprise and infrastructure markets. The company is a wholly-owned subsidiary of Silicon Image, Inc. For more information, visit http://www.sibeaminc.com.
This news release contains forward-looking statements within the meaning of federal securities laws and regulations, including, but not limited to, statements regarding the availability, performance, functionality, features, benefits and applications of SiBEAM Snap technology-based semiconductor products. These forward-looking statements involve risks and uncertainties, including the risk that SiBEAM Snap technology-based products will not perform as anticipated or provide the functionality, features and benefits described in this news release, as well as the risks and uncertainties described from time to time in Silicon Image’s filings with the Securities and Exchange Commission (SEC), which could cause the actual results to differ materially from those anticipated by these forward-looking statements. Silicon Image assumes no obligation to update any forward-looking statement.
SiBEAM and the SiBEAM logo are trademarks, registered trademarks or service marks of SiBEAM, Inc. in the United States and/or other countries. All other trademarks and registered trademarks are the property of their respective owners in the United States and/or other countries.
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