DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging
DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, has announced the full commercialization of DuPont™ WBR 2000 Series dry film photoresist material for advanced semiconductor packaging applications, including electroplated solder, photostencil and copper pillar bumping. These newest DuPont dry film photoresists offer a lower overall cost of ownership, while addressing productivity and environmental challenges. Specifics on the use of DuPont™ WBR 2000 dry film photoresist for copper pillar metallization will be shared at the upcoming IMAPS Device Packaging Conference 2008 in Scottsdale, Ariz., March 18-20, 2008.
“Even the most advanced packaging designs can be produced cost effectively with DuPont™ WBR 2000, and the idea of a dry, solventless process is more appealing from an environmental standpoint,” said Mats J. Ehlin, global business manager for DuPont Advanced Packaging Lithography. “DuPont™ WBR 2000 has unique advantages, which is why it’s quickly gaining acceptance as a reliable, well-performing photoresist with a good range of use. DuPont is continuing to innovate with dry films as a superior alternative to liquid photoresists, and we’re pleased to see our customers achieve new heights using this film.”
DuPont™ WBR 2000 Series dry film photoresists deliver improved resolution, speed and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint. Due to its high heat resistance, chemical compatibility and easy removal, WBR 2000 is well-suited for multi-purpose use, including in-via and mushroom plating, photostenciling and copper pillar metallization.
Unlike liquid resists, DuPont™ WBR 2000 Series dry film photoresists do not require drying of solvents, and can be applied in a single uniform layer across the entire wafer, with no edge bead. These properties enable higher productivity and yields, particularly for those manufacturers that require thicker layers, which are more difficult to produce with liquid resists. Films are available in 50, 75, 100 and 120 micron thicknesses.
DuPont will be sharing technical details on a key WBR 2000 application at the IMAPS Device Packaging Conference 2008 at the Radisson Fort McDowell Resort in Scottsdale, Ariz., March 18-20, 2008, in a session titled, “Optimization of the Dry Film Lithography Process for Copper Pillar Metallization Applications,” scheduled March 19 at 7:30 am MST.
For more information on DuPont Advanced Packaging Lithography, DuPont™ WBR 2000 or to view abstracts of all the technical papers DuPont will present at the IMAPS Device Packaging Conference, please visit advpackaging.dupont.com.
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