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Hynix and Toshiba Sign Semiconductor Patent Cross Licensing and Supply Agreements


Hynix Semiconductor Inc. and Toshiba Corporation announced today that they have signed patent cross licensing and product supply agreements covering semiconductor technology. Under the agreements, Hynix and Toshiba will be cross licensed to use one another’s semiconductor patents.

The agreements settle all pending patent-related litigation between the companies in the U.S. and Japan, including that before the U.S. International Trade Commission.

Mr. OC Kwon, Senior Vice President, Hynix Semiconductor Inc. said, “We believe the agreements will become a good foundation for our two companies to build a mutually beneficial business relationship in the future.”

Mr. Shozo Saito, Corporate Vice President and Executive Vice President of Semiconductor Company, Toshiba Corporation, said, “The signing of the agreements is a positive step for both companies. With litigation behind us, and through these agreements, we can now strengthen our respective businesses.”

About Hynix Semiconductor Inc.
Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (DRAMs) and Flash memory chips to a wide range of established international customers. The Company’s shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about Hynix is available at

About Toshiba Corporation
Toshiba is one of the world’s leading electronics firms. It is a diversified manufacturer of advanced electronic and electrical products spanning information and communications equipment and systems, digital consumer products, semiconductors and other electronic devices and components, power systems, industrial and social infrastructure systems and home appliances. For more information, visit


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