Delphi Engineer to Discuss Emerging Trends in Automotive Wiring Harness Production
Seminars to be held at the National Electrical Wire Processing Technology Expo, Milwaukee, Wisc.
TROY, Mich., — James Miller, superintendent of process engineering, Delphi Packard Electrical/Electronic Architecture, will be leading industry discussions on the emerging trends affecting wiring harness processing at the National Electrical Wire Processing Technology Expo in Milwaukee, Wisc., on May 21-22, 2008.
Miller will facilitate two seminars, “Trends that Impact Automotive Wiring Harness Design” and “Problems with Miniaturization on Automotive Wire Harness Production” in the Main Seminar Room, Hall B, Third Floor at the expo.
Miller says consumer demand and competitive pressures are forcing vehicle manufacturers to add a growing number of innovative features to their vehicles, which is greatly affecting electrical/electronic architecture and components. These seminars will review examples of past component innovation that drove major change, discuss current component trends affecting connectors, terminals and seals, and cable and their impact on existing processes.
One particular product, Delphi’s Halogen Free Ultra Thin-Wall Cable, delivers what vehicle manufacturers are looking for today. It is environmentally friendly and highly durable, yet significantly thinner and lighter than traditional cable. It also significantly exceeds SAE and ISO testing standards for abrasion, can deliver up to a 27 percent weight reduction and a 47 percent volume reduction. Its insulation properties also help facilitate smaller gage wiring such as Delphi’s 0.13 mm2 Cable.
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