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Delphi Technologist Plays Key Role in New Book on Lead-Free (Green) Electronics


Richard Parker is Co-Editor of Book Entitiled “iNEMI Projects Lead to Successful Manufacturing”

KOKOMO, Ind. — Richard D. Parker, lead technologist for advanced assembly technologies at Delphi Electronics & Safety Division of Delphi Corp., has recently completed co-editing a book on lead-free electronics that was released in October 2007. Entitled Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing, the book is based on a six-year study into lead-free electronics and provides full coverage of the issues surrounding implementing lead-free solder into electronic assembly boards.

“We are especially proud to have Rich as one of the co-editors of this new book,” said Bob Schumacher, Delphi Electronics & Safety director of Advanced Product & Business Development. “His work on lead-free solder is a pivotal piece in our vision to keep our products and processes focused on being environmentally-friendly.”

The book features contributions from several hundred researchers at more than 100 companies, universities and government agencies. It includes chapters by industry experts on lead-free processing and covers topics such as solder material properties, reliability testing, lead-free rework and tin whisker mitigation. The book is available from Wiley IEEE Press

“Rich has been a valuable contributor to iNEMI’s lead-free initiatives,” said Jim McElroy, CEO of iNEMI. “He was not only instrumental in the publication of this book, but also in the work described by the book. His leadership and vision have been -- and continue to be -- integral to iNEMI’s successes in this area. This would not be possible without the management support and sponsorship of Delphi Electronics & Safety.”

Parker serves as the chair of the iNEMI (International Electronics Manufacturing Initiative) Tin Whisker Project, Phase II. Tin whiskers are a condition that sometimes occurs when lead-solder is replaced by tin solder. Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from surfaces where tin (especially electroplated tin) is used as a final finish. Numerous electronic system failures have been attributed to short circuits caused by tin whiskers that bridge closely-spaced circuit elements. Parker’s team focuses on identifying the root causes of whiskers to minimize the risk of system failures.

Parker received a bachelor of science degree from the former General Motor’s Institute in 1975 and has served in various engineering assignments at Delphi Electronics & Safety Division in Kokomo, Indiana.

The International Electronics Manufacturing Initiative’s mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. This industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (in the Washington, D.C. area), with a representative office in Shanghai, China.

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