News by Industry

Electronic Components

Releases published in the last 30 days.

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Thinfilm receives NFR grant for project with SINTEF
1/30/2015 11:12:49 AM
Thin Film Electronics ASA (“Thinfilm”) (OSE: THIN.OL), a leader in the development and commercialization of printed electronics and smart systems, announced today that The Research Council of Norway (NFR) has awarded Thinfilm a grant of NOK 12 million (approximately US$1.65 million) for research into novel assembly methods and barrier coatings for printed electronic …
NXP Semiconductors awarded D-PAS Certification
1/29/2015 8:53:04 AM
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its Integrated Circuit (IC) for secure card payments has been granted D-PAS certification by Discover Financial Services. The certification applies to implementation of EMV across Discover Network. NXP’s technology now supports all major payment network brands for the U.S. EMV migration and further strengthens its …
Renesas Electronics Unveils New Solution to Increase Productivity and Security for Industrial Internet of Things Applications
Renesas Electronics Unveils New Solution to Increase Productivity and Security for Industrial Internet of Things Applications
1/27/2015 11:40:07 AM
Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the availability of the RX71M Group as the new flagship product in the RX Family of 32-bit microcontrollers (MCUs). Developed for use in industrial equipment, the new series doubles the CPU operating frequency to 240 megahertz (MHz) from the 120 MHz of previous …
Tektronix Launches TekScope Anywhere to Improve Collaboration, Boost Productivity
1/27/2015 10:11:58 AM
Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced TekScope AnywhereTM , a new software offering that extends the visualization, analysis, and reporting capabilities found on Tektronix oscilloscopes to Microsoft Windows-based PCs, tablets and servers. By decoupling analysis tools from the oscilloscope, engineers can now do much of their work …
HyperLynx Alliance Accelerates High-Speed Design-Ins and Verification
1/27/2015 9:24:56 AM
HyperLynx Alliance Program Highlights HyperLynx® Alliance formed by Mentor Graphics and key industry partners provides free access to virtual reference designs plus tools, design data and identified best-practice methodologies for difficult SerDes and DDR design and verification challenges Founding partners include Altera, PMC-Sierra, Samtec, Inc. and eASIC New …
Mitsubishi Electric to Consolidate Development and Manufacture of PLC and Operator Panels at Nagoya Works
Mitsubishi Electric to Consolidate Development and Manufacture of PLC and Operator Panels at Nagoya Works
1/26/2015 9:23:18 AM
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that in a continuing effort to expand its global business in factory automation (FA), the company will consolidate the development and manufacture of programmable logic controllers (PLCs) and operator panels, core products for FA, at its Nagoya Works from this April. The development and manufacture of Micro …
Infinx designs & implements a robust Bicycle sharing system for one of the largest Bicycle Sharing Groups in the U.S
1/23/2015 11:54:41 AM
Infinx Services, a Global Business Process and Technology Solutions Company recently designed & implemented a robust Bicycle sharing system for one of the largest Bicycle Sharing Providers in the USA. Bicycle sharing systems have in recent years, provided a viable and congestion-reducing transportation option for the urban populace. The self sustaining system of publicly …
Papros Data Brings Creation of Product Material Declarations to Mobile Platforms
1/20/2015 8:00:00 PM
 Green leader Papros Inc, announced enabling of material declaration creation using mobile platforms. Explained Dr. Nagaraj “Hitherto, most complex material declarations management was done in scenarios where the typical office worker was on a laptop or desktop, and had solutions for processing spreadsheet data that usually could be accessed by application visual basic or …
Tektronix Unveils Comprehensive USB 3.1 Compliance Test Solutions
1/20/2015 10:22:30 AM
Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today released a comprehensive set of USB 3.1 compliance test solutions that allows designers to quickly verify designs against the latest USB specifications and achieve fast time to market while minimizing costs. The new release expands Tektronix’ already extensive USB 3.1 and USB 2.0 test capabilities to …
Toshiba Announces Commercial Production of FFSA™ for NEC iPASOLINK™ Microwave Backhaul Products
1/19/2015 11:39:56 AM
Toshiba Corporation (TOKYO: 6502) today announced that NEC Corporation (NEC), having previously chosen the Toshiba FFSA™ (Fit Fast Structured Array) flexible custom LSI solution, has now moved to the commercial production phase of its iPASOLINK™ high capacity microwave communication equipment for mobile networks, utilizing this innovative solution.   "NEC has adopted FFSA™ …
Microchip Expands Family of Serial Quad I/O™ SuperFlash® Memory Devices With 1.8V Low-Power 4-Mbit and 8-Mbit Memory
Microchip Expands Family of Serial Quad I/O™ SuperFlash® Memory Devices With 1.8V Low-Power 4-Mbit and 8-Mbit Memory
1/19/2015 11:15:27 AM
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced an expansion of its 1.8V Serial Quad I/O™ (SQI) SuperFlash® Memory with the SST26WF080B and SST26WF040B devices.  These devices offer 4-Mbit and 8-Mbit of memory and are manufactured with Microchip’s high-performance SuperFlash technology, which …
New IBM Study Details the Future of Automotive Industry
1/15/2015 10:34:31 AM
During the Automotive News World Congress this week, IBM (NYSE: IBM) revealed results of its new Automotive 2025 Global Study, outlining an industry ripe for disruptive changes that are breaking down borders of the automotive ecosystem. The study forecasts that while the automotive industry will offer a greater personalized driving experience by 2025, fully autonomous vehicles …
Latest Tensilica Processors Deliver Up to 75% Memory Power and Area Savings
1/12/2015 5:43:50 PM
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the 11th generation of the Tensilica® Xtensa® processors. The new Xtensa LX6 and Xtensa 11 processors enable users to create innovative custom processor instruction sets with up to 25 percent less processor logic power consumption and up to 75 percent better local memory area and power efficiency. The latest …
Avnet Embedded Signs Distribution Agreement for the Americas with Embedded Motherboard Supplier MiTAC Computing Technology Corp.
1/12/2015 10:00:23 AM
To alleviate market pressure due to diminishing industry support for desktop motherboards, Avnet Embedded, a division of Avnet Electronics Marketing Americas, a business region of Avnet, Inc . (NYSE: AVT) today announced a new distribution agreement with MiTAC Computing Technology Corp (MiTAC Computing Technology), a subsidiary of MiTAC Holdings Corp. (TWSE:3706), a global …
SAMSUNG Mobile App Academy Awards Top High School Students with $35,000 in Scholarships
SAMSUNG Mobile App Academy Awards Top High School Students with $35,000 in Scholarships
1/9/2015 8:46:30 AM
Samsung Telecommunications America (Samsung Mobile) announced its 2014 Samsung Mobile App Academy winners at the 2015 International Consumer Electronics Show (CES). The 11th and 12th graders were awarded scholarships for their mobile application (app) concepts following Samsung’s summer mobile app and coding program. As app development continues to surge as one of the most …
Antimicrobial Corning® Gorilla® Glass to Be Used in Mobile Pay Terminals
1/7/2015 12:02:18 PM
  Corning Incorporated  (NYSE: GLW) today announced that Clover, a  First Data  company, will begin using  Antimicrobial Corning® Gorilla® Glass  as the cover glass in its  Clover™ Mobile  devices. Clover will be the first company to use Antimicrobial Gorilla Glass in payment terminals.  Corning Gorilla Glass  can help protect these and other frequently touched surfaces from …
SiBEAM Announces Revolutionary Snap Wireless Connector Technology
1/6/2015 8:26:23 AM
SiBEAM, a pioneer and leader in millimeter wave technologies for wireless communications, today announced SiBEAM Snap™ wireless connector technology that will not only transform how consumers connect their devices, but will enable thinner and more robust mobile devices. Consumers today use their mobile devices everywhere and expect those devices to have stunning designs and …
Cambrios and CN Innovations Announce Mass Production of Silver Nanowire Touch Panels
1/5/2015 1:51:40 PM
Cambrios Technologies Corporation , the leader in silver nanowire-based solutions for the transparent conductor markets, and CN Innovations (CNI), well known for developing touch sensors by using roll-to-roll and sheet form laser technology included in many devices, today announced that CNI is shipping in mass production Cambrios’ ClearOhm® silver nanowire-based touch panels …
STMicroelectronics Paves the Way to Next-Generation High-Speed Broadband Experiences with Successful DOCSIS® 3.1 and RDK-B Demonstration
1/5/2015 11:42:12 AM
STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, is previewing a new high-performance DOCSIS® 3.1 platform in a live demonstration in Las Vegas during the Consumer Electronics Show. Next generation DOCSIS3.11 cable modems will help Multiple System Operators (MSOs) satisfy surging consumer demand …
Quantenna Demonstrates 10G Wi-Fi Platform at CES 2015
1/5/2015 11:31:29 AM
CES -- Quantenna Communications, Inc.. the leader in ultra-high performance Wi-Fi, today announced that it is demonstrating its 10G Wi-Fi™ platform at CES 2015, the world’s first system to fully implement full 802.11ac Wave 2 functionality including fully configurable up to 8x8 MIMO, Multi-User MIMO (MU-MIMO) and 160Mhz channel support with the ability to deliver up to …