Introducing the world’s first "Chip ID marker" for semiconductor chips
Komatsu Ltd. (President and CEO: Kunio Noji), through Komatsu Engineering Corp. (President: Toshihisa Naruse and Head Office: Kawasaki City, Kanagawa Prefecture), a wholly owned subsidiary, has developed the “Chip ID marker” which allows IC chip makers to write information such as manufacturing history on individual IC chips on the silicon wafer. Komatsu Engineering just launched sales in May.
For the last few years, the production of hybrid cars and electric vehicles has rapidly increased, driven by the expanding market of eco-friendly cars. In addition to performance, it is becoming indisputably indispensable for IC chip makers to include their manufacturing history on semiconductors used in electronic devices of such cars and vehicles in order to improve their safety and reliability.
For its “Chip ID marker,” Komatsu has led the world by developing and applying the laser irradiation-based “Convex dot formation method” which allows customers to physically write their manufacturing history on the top surface of individual IC chips on the wafer.. As circuits are drawn on the top surface of IC chips, it was previously impossible to give physical ID marking in a very limited space on the surface with conventional technologies. Komatsu’s “Chip ID marker” enables chip makers to secure traceability of individual IC chips. As a result, chip makers are now able to prevent defective chips from mixing in other chips during the manufacturing process. Even if some technical problems should occur in chips, chip makers will be able to promptly retrieve their manufacturing history and thereby make a quick response and identification of the causes.
ID is a 2D code (data matrix code) in accordance with the SEMI(*1) standard, and the code size is 100μm X 100μm or smaller, achieving the world’s minimum-sized ID marking. The dots that compose the ID are minute convex dots that could not have been achieved by conventional marking equipment. Another important feature is virtually zero dispersion, thanks to the “Convex dot formation method” based on the new method of laser irradiation. This equipment is also capable of simultaneous code-reading and writing for high throughput. It is also designed to handle wafers in sizes from 5 to 8 inches.
*1 SEMI:Semiconductor Equipment and Materials International
[New Chip ID marker ]
1.High-speed writing of IDs of the code size 100μm X 100μm or smaller
2.Komatsu’s original optical method which achieves virtually zero dispersion for minute IDs
3.Simultaneous reading/writing information
4.High-speed throughput on par with the wafer prober equipment speed
Automotive semiconductors, MEMS sensors, and semiconductor IC chips for medical and other equipment
Dimensions 2260mm (width) X 1250mm(depth) X 1790mm (height when the hinge rotates)
Total weight 1300Kg
Utilities Electricity: AC100V-AC110V, 50/60Hz,30A
Air pressure: 0.4-0.7Mpa
Flow volume:18NL/ Min and above
Vacuum: -0.05Mpa or below
Flow volume:15NL/ Min and above
Marking ID marking consisting of convex dots by means of laser irradiation
Wafer sizes 5 inches, 6 inches and 8 inches
Type of code Data matrix code(16 dots X 16 dots or 20 dots X 20 dots)
Code size Standard: 100μm X 100μm(16 dots X 16 dots), Capability: up through 50μm-200μm
Throughput Approx. 2 seconds/chip (250 chips/wafer at 24 pieces)
Orders: Receiving in May 2009
5 units for the first year
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