QUALCOMM UMTS/HSDPA Solutions Selected by More Than 30 Wireless Industry Leaders for More Than 120 Devices
Company’s UMTS Chipset Deliveries Continue to Accelerate with a Fourfold Increase Throughout 2005
SAN DIEGO — February 09, 2006 — QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced that its UMTS/HSDPA solutions have been adopted by wireless industry leaders around the world, demonstrating a momentum surge for QUALCOMM chipset solutions. The Company currently counts as customers more than 30 major UMTS/HSDPA device manufacturers, who together have designed and/or launched more than 120 wireless device models based on Mobile Station Modem™ (MSM™) chipsets.
“QUALCOMM is committed to meeting the needs of all of our customers and to supporting the entire wireless value chain,” said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. “The global adoption of our UMTS and HSDPA solutions is an indication of the growing momentum of the industry-wide drive to deploy 3G networks, products and services around the world.”
QUALCOMM offers multiple solutions to address demand for entry-level UMTS devices that integrate cost-effective voice, data and basic multimedia capabilities. The Company initially offered the 90 nanometer (nm) MSM6250A™ chipset, selected for 27 handsets which are currently commercially available or in development. In the second quarter of 2006, the Company will sample the 65 nm MSM6245™ chipset, together with the RTR6275™ UMTS/EDGE transceiver radio frequency (RF) integrated circuit (IC), providing significant cost and power-efficiency benefits for mobile devices. The RTR6275 is the world’s first single-chip, single-band UMTS and quadruple-band EDGE RF CMOS transceiver IC.
QUALCOMM’s industry-leading UMTS/HSDPA solutions include the MSM6275™ chipset, the world’s first HSDPA solution, which has been selected for 32 mobile handsets and data cards which are currently commercially available or in development. And in a further advance, QUALCOMM expects to sample the industry’s first HSUPA-capable chipset in the first quarter of calendar year 2006. The MSM7200™ will support UMTS, HSDPA and HSUPA networks with backward compatibility to GSM/GPRS/EDGE and features advanced multimedia, connectivity, position location and data capabilities.
Don’t miss our live UMTS/HSDPA demonstrations, including the next-generation MSM6280™ chipset supporting 7.2 Mbps HSDPA with receive diversity, at 3GSM 2006 in QUALCOMM Booth #40B
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2005 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 25, 2005, and most recent Form 10-Q.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. Mobile Station Modem, MSM, MSM6275, MSM6280, MSM7200, MSM6245, MSM6250A, RTR6275, RFR6500, and RFR6525 are trademarks of QUALCOMM Incorporated. All other trademarks are the property of their respective owners.
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