NEC Electronics Introduces Four New MOSFET Devices with Ultra-thin Packages

Targeting the Market of Personal Car Navigation System and Low-end PCs

NEC Electronics Corporation today introduced the four new metal-oxide-semiconductor field-effect-transistor (MOSFET) families; N0100P, N0301P, N0302P, and N0301N. All of these new MOSFETs are housed in SOT-23 package that complies with standards of JEDEC, the standardizing body for the electronics industry, and are ideal for use in personal car navigation system called personal navigation device (PND) and low-end PCs. The new MOSFETs are available now.
Package heights of the new MOSFETs are reduced by 0.1 mm compared to current generation SOT-23 packages by employing flat lead package. The new MOSFETS are also capable of achieving up to 4.5 A (N0301N only) of current even with mounting area equivalent of SOT-23 package, allowing designers to realize thinner and lighter PNDs and low-end PCs with higher current capabilities.
As the recent industry-wide trend for handy and low price portable applications such as PNDs and low-end PCs expands, demands for MOSFETs with advanced functions to realize DC/DC converters and load switches are growing accordingly. To address these growing needs, NEC Electronics has been actively developing its business in this field launching MOSFETs with packages that manage low on-state resistance, using the company’s advanced techniques such as super junction technology, multi-bonding and wire-less bonding technologies. Yet, there is still strong customer expectations for smaller MOSFET packages with up to 4 A current capability that allow designers to develop lighter and slimmer products, which is exactly what the NEC Electronics’ new MOSFETs provide. NEC Electronics believes this new lineup of MOSFETs to be most suitable for portable applications and plans to market them actively. Following is the significant features of the new MOSFETs:

* (1) Provided with Slim packages
NEC Electronics improved the lead structure of the new MOSFETs’ packages, employing flat lead structure instead of the conventional gull wing structure. This makes it possible to decrease the package height by 0.1 mm enabling designers to realize a smaller design footprint.
* (2) Up to 4.5 A of current capability (N0301N only)
By adopting flat lead structure, packages of the new MOSFETs are capable of carrying larger chips, yet still provide the high current capabilities of up to 4.5 A (N0301N only). These larger chips enable the new MOSFETs to reduce on-state resistance of up to 20 percent compared to the existing MOSFETs.
* (3) Wider selection of MOSFETs
The new devices include three P-channels and one N-channel MOSFET offering designers to choose the best option depending on their systems.


See appendix for the main specifications of the new products.

Pricing and Availability
The new MOSFETS are available now in production quantities. The sample prices of these new products vary depending on current and on-state resistance (Note). For example, N0301N MOSFET with 4.5 A of current and 33 mΩ of on resistance is priced at U.S.$ 0.3 per unit. Mass production of these new products is scheduled to begin in June 2009 with a monthly production of 5,000,000 units. Pricing and availability are subject to change.

NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. More information about NEC Electronics worldwide can be found at www.necel.com.

(Note)
On resistance: A measure of the degree to which a MOSFET opposes an electric current through it.
Smaller the on resistance, Larger the current capability is.
(Remark)
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