AMD Offers New Package Features for Embedded Markets
—Helps system designers reduce enclosure size without sacrificing performance—
SUNNYVALE, Calif.-AMD (NYSE: AMD) today announced immediate availability of the AMD Sempron™ 210U and 200U processors for embedded systems. These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD’s Direct Connect Architecture.
“These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance,” said Buddy Broeker, director, Embedded Product Marketing, AMD. “Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design.”
Customers can further streamline development by pairing the new AMD Sempron processors with the AMD M690E chipset. This complete and robust embedded platform can help speed time to market and deliver the graphics and display options that are increasingly important in embedded systems.
“Whether it’s clients for cloud computing, virtual desktops, or as a green replacement for a PC, customers turn to Wyse for powerful client solutions that deliver the rich sound and graphics common with today’s applications,” said Curt Schwebke, CTO for Wyse Technology. “The new AMD Sempron 210U processors enable us to deliver high performance in a very low power thermal range, and with the BGA package, we are able to offer increasingly compact designs.”
Embedded systems based on the AMD Sempron 210U and 200U processors are also available from iBASE, aValue, EVOC, Gigabyte, and Inventec while additional AMD embedded customers are expected to bring systems to market in 2009.
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