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Fujitsu Introduces the First 802.3ap (KR) Compliant 10GbE Switch IC, Featuring the Industry’s Highest Density of 26 Ports and Lowest Power Consumption


Compact, Low Latency, Fully Integrated MB86C69RBC is Ideal for Backplane, Blade Server, Advanced TCA and Enterprise Applications

Sunnyvale, California, April 2008 — Fujitsu Microelectronics America, Inc. (FMA) today extended its global leadership in advanced, single-chip Ethernet switch technology by introducing the 26-port MB86C69RBC. The industry’s highest density, lowest power and smallest footprint 10-Gigabit Ethernet (10GbE) switch IC, the new L2/L3 capable device features the direct support of 10Gbps serial interface for Ethernet backplane standardized as 802.3ap (KR) on all 26 ports, as well as SFP+ capability.

Targeting data-center and telecom equipment applications, the MB86C69RBC integrates a comprehensive set of advanced Ethernet, Layer-2, data-center bridging, QoS and Layer-3 capabilities, along with 2.9MB buffer memory, more than any comparable switch chip. The new IC embeds 26 multi-rate high-bandwidth ports and a pair of 10/100/1000GbE management ports into a highly integrated package measuring a compact 35mm x 35mm.

Integrated, programmable, high-speed SerDes allows each port to directly support the 10GBASE-KR standard for backplane serial connectivity, along with 1000BASE-KX. Fully compliant 10Gbps serial XFI/KR capabilities allow designers to achieve connectivity using fewer physical connections to the backplane or the XFP/SFP+ optical module, all with the lowest power consumption and overall switching latency in the industry. The result is maximum flexibility for applications such as high-density backplane switching, blade server switching, microTCA MCH designs, and Advanced TCA carrier-board backplane-fabric applications.

Low-Power Consumption, Low-Switching Latency

The Fujitsu MB86C69RBC, which consumes only 22 watts (W) under full load conditions, supplies 520Gbps of non-blocking aggregate switching capacity in cut-through and store-forward operating modes. Overall system switching latency, including SerDes in cut-through mode, is only 300 nanoseconds, the lowest in the industry.

“This new switch responds to the service providers’ need for more bandwidth at lower costs. The chip is capable of delivering congestion-free wire-speed throughput while maintaining quality of service, low latency, and high integration at a low per-port system cost, enabling system designers to deliver solutions suitable for a wide range of applications,” said Asif Hazarika, Director of FMA’s Networking ASSP business group. “The chip’s sophisticated congestion management and per priority PAUSE technology is critical for optimal performance in server virtualization and consolidation applications, which are being supported by the converged data fabrics emerging in today’s data center.”

10Gbps Ethernet has become a very important market worldwide. In 2010, 10Gbps will represent 19.2 percent of end-user spending in the enterprise Ethernet switch segment, according to Gartner, Inc. (Forecast: Enterprise Ethernet Switches, Worldwide, 2005-2011, August 30, 2007).

Fujitsu Siemens Computers has integrated Fujitsu’s state-of-art switch chip into its PRIMERGY BX600 Blade Server System. The 12-port MB87Q3141 chip provides a 10Gbps Ethernet virtualization infrastructure for the product’s recently announced solution stack ( Fujitsu Siemens Computers was impressed by the component’s performance, technical quality, robustness and support. The positive experience in introducing the first-generation 10Gbps Ethernet solution stack into the PRIMERGY BX600 Server Blade line has encouraged the company to investigate second-generation solution stacks based on the 26-port MB86C69RBC for future blade systems.

Direct Links to Serial Backplanes and Optical Modules Reduce Cost, Complexity, Development Time

With 10Gbps serial capabilities on each port, the Fujitsu MB86C69RBC can directly connect to XFP, SFP+ modules or chassis backplanes (802.3ap-KR) on any port, eliminating the need for third-party SerDes chips and significantly reducing board complexity, power, costs and development time. The chip supports full Layer-2 features and eight priority classifications per port, based on IPV4 and IPV6 DiffServ, MAC address, and 802.1Q VLANs. Data center Ethernet features include per priority PAUSE, backward-congestion notification and early-drop watermark capabilities for congestion avoidance. The device also has L2, L3 ACL, and L3 forwarding capabilities.

In addition to the standard 4K VLAN and QinQ capabilities, the switch chip provides 64-user VLAN addresses that can be used to logically partition a network without the use of QinQ. VLAN translation capabilities allow users to translate VLANs from external customers to VLANs from internal providers.

The chip’s flexibility is reflected in its integrated KR/XAUI/CX4/KX SerDes and KR capabilities for all 26 high-speed ports.

Ultra-Low-Power Requirements Ideal for ‘Green’ Applications

Fabricated in the state-of-the-art low-power process technology, the MB86C69RBC typically consumes 22W under full load conditions. This makes the new switch an excellent choice for environmentally oriented, low-power green applications.

The MB86C69RBC is Fujitsu’s newest high-density 10GbE switch IC. In August 2006, the company introduced its 20-port 10GbE switch chip, which delivers 400+Gbps, non-blocking, aggregate switching bandwidth through 3Mbytes of proprietary, multi-stream shared buffer memory, with on-chip 10Gbps serial SerDes. “Today’s introduction extends Fujitsu’s long and successful lineup of advanced Ethernet switching technology that continues to set the pace for the industry,” said Hazarika.


The new MB86C69RBC-GE1 will be available in June in FCBA1156 packages. Pricing is available upon request.


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