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Infineon Announced its Rich Portfolio of Semiconductor Solutions for the Mobile Market


Neubiberg, Germany and Barcelona, Spain – February, 2008 – Infineon Technologies (FSE/NYSE: IFX), a leading supplier of advanced communication ICs and solutions, today announced sample availability of its latest low cost platform family in 65 nanometer as well as two new highly integrated and power-efficient members of its Mobile TV IC family. Furthermore, Infineon introduces instant messaging and e-mail functionality for entry mobile phones.

“We are excited to once again show such a broad portfolio of innovative semiconductor solutions for future mobile communications to our customers and a broad public”, said Dominik Bilo, Senior Vice President and head of Sales and Group Marketing of the Communication Solutions Business Group with Infineon. “With the semiconductor solutions presented today, we confirm once again our technology leadership in the area of true monolithic integration.”

With its third generation of Single-Chips, the X-GOLD™113 and X-GOLD™213, Infineon enables advanced mobile phone features such as camera, mobile internet and audio-entertainment accessible in low-cost markets. The integration of these features has allowed suppliers to reduce the production cost, of core mobile functions, by up to 40 percent relative to more traditional solutions. The new chips are sampling now and a first call on air has already been successfully conducted. As part of a complete mobile platform the company enables features, in price sensitive markets, which until now have only been offered in the high-tier segments. Users without personal computers can now access the Internet using their mobile phones while they are on-the-go – including news reports, weather forecasts, prices of goods, navigation or e-mail. In addition digital photos can now be taken and quickly shared. Radio programs or MP3 data, including podcasts, can now be availed of without any additional costs.

Infineon is the first company to demonstrate e-mail and chat functionality on ultra-low-cost mobile phone solutions, also called smart entry mobile phones. The solution allows simultaneous access to all leading communication portals such as MSN, ICQ, Chikka or Yahoo on average wap based phones. Smart entry phones will enable users to receive fast-and-easy access to chat and e-mail on low cost mobiles.

Additionally Infineon shows new members of its successful Tuner IC family. The two new Tuner solutions primarily address mobile applications and offer system IP blocks to further complement Infineons mobile handset platform for high-end phones. The companies’ latest digital tuner solutions, the OMNIVIA™ TUS 9090 and the OMNITUNE™ TUA 9001 enables customers to enter and competitively participate in the market through value-added, advanced solutions and target digital mobile TV applications such as mobile phones, PDA’s, mobile media players and laptops. Enabling miniaturization of electronics system design, these new Infineon solutions will drive towards lower system costs, reduced power consumption and eventually an increased adoption rate of Mobile TV technology and applications.

Furthermore the company leverages its unique advantages in the areas of true, monolithic integration and leading 7.2 HSDPA modem technology and has announced that another tier 1 handset company has selected its RF chip SMARTi™ UE+ for HSxPA/ EDGE products. This Single Chip RF significantly improves the signal quality from base station to handset, increasing the effective data throughput and reducing the required network resources. Users experience a higher effective downlink speed, better network coverage and less drops in Voice over IP- and video-applications while the network operators can significantly increase their network capacity and quality of service. With its architecture SMARTi UE+ enables phone manufacturers to reduce testing cycles in the production processes by more than a factor of 10.

You can find more information on Infineons innovative solutions at the Mobile World Congress in Barcelona, Spain in Hall 1, booth B19.


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