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Zenite® LCP Meets Needs of Thinner Electronic Parts


A new grade of DuPont™ Zenite® LCP liquid crystal polymer meets needs for ultra-low warpage in the thinner part designs used in ever smaller electronic devices. Typical applications for new Zenite® ZE55201 include electronic connectors, chip sockets and interposers.

“Standard resins that perform perfectly well in thicker parts can produce unacceptable warpage in the emerging generation of low-profile designs,” said Bill Hassink, senior market development specialist for DuPont Engineering Polymers. “New Zenite® ZE55201 has shown that it can meet the challenge in molding trials and early production experience.”

The new resin’s ultra-low-warp performance is achieved by reducing anisotropic shrinkage. Its flow direction shrinkage is similar to that of a typical 30 percent glass-reinforced LCP, but its cross-flow shrinkage is more than 50 percent lower.


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