DuPont Will Feature Reliability and Integration Solutions for Electronic Packaging at IMAPS

The International Symposium on Microelectronics (IMAPS) will be held at the McEnery Convention Center in San Jose, California on November 11-15, 2007. This year marks the 40th anniversary of IMAPS.

Exhibiting at DuPont booths 521 and 523 will be DuPont Microcircuit Materials, featuring LTCC Green Tape™, and DuPont™ Interra™ Embedded Passive Materials.

DuPont Microcircuit Materials will present 2 technical papers at the conference:

* LTCC Design Techniques for Microwave Integrated Circuits used in Radar and T/R Modules
November 13, 1:45-4:55 PM
This presentation will discuss the use of DuPontÔGreen TapeÔLTCC for phased array radar and T/R modules.
» View the abstract

* Embedded Discrete High K Capacitor Characterization in LTCC
November 15, 12:45
This paper will discuss in detail the measurement results of the embedded discrete high K capacitors when fabricated within a Low Temperature Co-fired Ceramic (LTCC) structure.
» View the abstract

* DuPont™ Interra™ Embedded Passive Materials offer planar capacitor laminates and thick film capacitors and resistors for increased performance in smaller electronic components.