Ditech Networks Accelerates Next-Generation IP Networks with TIís Carrier Infrastructure Platform
Voice Quality Solution Supports High-Density Voice and Delivers Carrier-Class Reliability
BOSTON . - Texas Instruments Incorporated (TI) [NYSE: TXN] today announced that Ditech Networks (NASDAQ: DITC), a leading provider of voice quality solutions to the worldís communications industry, has selected TIís advanced carrier infrastructure platform for use in future platform products.
TIís TMS320TNETV3020 multicore digital signal processor (DSP)-based carrier infrastructure platform is flexible, scalable and incorporates high-density voice codec applications that enable Ditech to enhance the quality and performance of its voice quality solutions and to address next-generation carrier infrastructure requirements more cost effectively. This relationship defines both TI and Ditech as key influencers in the communications industryís migration to all-IP networks. For more information, go to www.ti.com/tnetv3020.
Ditechís voice quality solutions are deployed on the companyís high-density, flexible platforms, which allow carriers to optimize voice quality over both IP and TDM networks. Ditechís solutions for wireline and wireless service providers mitigate voice quality impairments that originate in the network, and in the callerís environment. The companyís platforms also are used to deploy Ditechís Dynamic Transcoding solution, which enables service providers to support diverse codecs in multiple IP networks. Ditech plans to use TIís TNETV3020 carrier infrastructure platform at the heart of its future solutions.
TIís TNETV3020 is powered by a six-core DSP and delivers 3 GHz of raw processing performance. Based on TIís high-performance TMS320C64x+ DSP core, the network, quality and power management features integrated directly on the TNETV3020 system-on-a-chip (SoC) device will enable Ditech to significantly increase the capacity of its current solutions while allowing the company flexibility for additional applications. Enabling these features directly from the core network gives Ditech the ability to support high-density voice quality applications, speeding time to market and saving development costs.
ďThe flexibility and performance features provided by TIís carrier infrastructure solutions make us comfortable that this platform is a secure investment for our future products, ensuring carriers high-quality voice service and solution longevity,Ē said Todd Simpson, President and CEO of Ditech Networks. ďTI and Ditech are aligned in our initiative to provide high-density performance and carrier-grade quality of service. This shared commitment to delivering the highest level of voice quality is what sustains our longstanding relationship with TI.Ē
As the telecommunications industry progresses towards enabling fixed mobile convergence (FMC), the network infrastructure requirements for next-generation IP networks are redefining carriersí expectations for voice quality. TIís TNETV3020 is a complete Voice over Packet (VoP) gateway solution with integrated power saving features that enable Ditech to reduce their bill of material (BOM) expenditures and readily support future network requirements.
ďTI recognizes the value of voice quality in next-generation networks, and our optimized DSP solutions meet this important network demand,Ē said John Smrstik, high density and core infrastructure business manager, Texas Instruments. ďOur TNETV3020 carrier infrastructure platform delivers several cost-saving benefits including greater flexibility and higher density, making it a complete silicon and software device for Ditechís next-generation solutions.Ē
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