UGS PLM Software Announces Grand Prize Winner of the Prestigious Asia Pacific Product Lifecycle Management (PLM) Innovation Award 2007
UGS PLM Software, a division of Siemens Automation and Drives (A&D) and a leading global provider of product lifecycle management (PLM) software and services, today announced that Samsung Electronics Co., Ltd, one of the top ten electronics manufacturers in the world, has won the grand prize in the Asia Pacific’s (AP) PLM Innovation Award 2007. Chery Automobile, Alcatel Shanghai Bell, Haier and Mahindra & Mahindra also received awards for their outstanding submissions.
Hosted by UGS PLM Software for the fourth year in a row, the AP PLM Innovation Award (previously known as the AP PLM Excellence Award) recognizes enterprises within Asia that have achieved exceptional business benefits through the use of PLM software and services. A record number of entries were received this year, with a greater number of entries coming from Japan, China, Korea and India, due to the increasing importance and adoption of PLM throughout the AP region. This year’s award also saw entries from a record number of diverse industries such as automotive, machinery, high-tech electronics and aerospace and defense.
“UGS congratulates Samsung Electronics on its well deserved win,” said Hans-Kurt Lübberstedt, senior vice president, Asia Pacific, UGS PLM Software. “This is a perfect example of how Asian companies are improving their understanding and use of PLM as a critical part of their business strategy and execution.”
Samsung Electronics uses PLM technology from UGS PLM Software as the foundation for its digital convergence revolution, a strategy for achieving the company mission of technology-based value innovation. UGS PLM Software’s solutions are supporting the company’s PLM initiatives including digital product design with automation, bill of material (BOM) management, digital mockups, knowledge management and concurrent engineering. Samsung Electronics’ entry won top accolades for several reasons:
Samsung Electronics was able to reduce mold development to 10 days for their top class cellular phone through its Mold Design & Manufacturing Automation, which is based on rules and knowledge.
Innovative top-down Configuration Based Design was employed, based on standard structure and specification. This provided effective management and reusability of computer-aided design (CAD) data and also allowed collaboration with SDS (Samsung Data System) and UGS PLM Software engineers.
The company was able to establish full 3D Research & Development processes from design to manufacturing with seamless data interfacing between the physical and digital worlds, resulting in a reduction of first-trial errors in production by 50 percent.
“PLM technology from UGS PLM Software supports Samsung’s PLM initiatives for digital product design with automation, data and bill of material (BOM) management, digital mockups, knowledge management and concurrent engineering,” said Sehyun Kim, vice president, R&D Innovation Team of Samsung Electronics.
The entries were evaluated according to the unique business challenges each company faced, the steps and solutions that each company took to overcome the challenges, the innovation made possible by PLM implementation, the benefits the PLM implementation enabled each company to gain, as well as the next steps in leveraging PLM solutions.
The winner and runner-ups this year will be invited to the UGS Connections 2008 event and the Grand Prize winner will receive UGS Teamcenter™ Community software and hardware set.
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