Rockwell Collins selected for DARPA advanced radio technology program
CEDAR RAPIDS, Iowa (November 07, 2006) - The Defense Advanced Research Projects Agency (DARPA) has selected Rockwell Collins to lead an effort under the Analog Spectral Processors (ASP) program, an initiative aimed at revolutionizing the state of the art in radio technology. ASP will employ Micro Electro-Mechanical Systems (MEMS) technology to create radio front-ends.
Rockwell Collins is also a contributing member on two eminent teams for the Micro Electro-Mechanical System / Nano Electro-Mechanical System Science and Technology (MEMS/NEMS S&T) Fundamentals Program.
In the ASP program, Rockwell Collins is teamed with the MEMS scientific community to develop an ultra-wideband, multi-channel receiver and spectral sensor. The development will leverage innovative RF architecture and novel RF MEMS technologies, which include high performance tunable filters and RF switches, leading to affordable, low-power heterogeneous integration.
“Employing MEMS technology in the development of the Analog Spectral Processors will significantly impact the communications industry by offering superior radio filter performance and flexibility for reduced cost, size, and power consumption,” said John Borghese, vice president of the Advanced Technology Center at Rockwell Collins. “While the benefits will be realized in all communications areas, the Joint Tactical Radio System program will be one of the first programs to reap the rewards of our work.”
Phase One of the ASP program includes development of filters and components which will be followed by a second phase where components will be integrated into filter banks and prototypes. Demonstration of the complete radio front end will take place in the third phase of the program.
This collaborative effort under the ASP program is led by Rockwell Collins. Other participants include Teledyne Scientific Company (formerly Rockwell Scientific), Cornell University, Stanford University, University of California-San Diego, Innovative Micro Technologies, MEMS Exchange and Sanmina-SCI.
Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronics solutions for both commercial and government applications. Our expertise in flight deck avionics, cabin electronics, mission communications, information management and simulation and training is strengthened by 18,000 employees, and a global service and support network that crosses 27 countries. To find out more, please visit www.rockwellcollins.com.
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