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Delphi Debuts Compliant Pin Technology for Wide-Ranging Automotive Interconnect Applications


Delphi Connection Systems’ press-fit, solder-free termination approach allows for numerous performance benefits in Connector-to-PCB mating
Release Date: 2006-06-19

WARREN, Ohio -- Delphi Corporation is bringing to market another advancement to the automotive connection systems market, strengthening its already robust product portfolio with the launch of its press-fit compliant pin technology.

A termination approach more widely exhibited in the telecom and aerospace industries, press-fit compliant pins provide a solder-less electrical connection, bringing together a connector component and a printed circuit board (PCB). Delphi Connection Systems has developed press-fit compliant pins that can be integrated into vehicle manufacturers’ device interconnect applications and integrated connector/module housings.

In short, a press-fit connection is made between a PCB with a plated through-hole and a connector sporting comparatively oversized compliant pins. Delphi Connection Systems’ compliant pin technology is characterized by the eye-of-the-needle design, which was selected due to its performance, reliability, manufacturability and cost attributes.

John McClearn, managing director of Delphi Connection Systems North America, noted that termination through compliant pin utilization allows automotive customers to realize a number of performance benefits, coupling environmental highlights with differentiating quality attributes in a manner that provides greater manufacture and design simplification.

“This technology allows customers a single-point answer for mechanical integration, thus enabling them to focus key resources on their core electronics competency. Mechanical attachment is simplified, and full repair capability is available through the easy exchange of connectors and contacts,” said McClearn, adding that Delphi Connection Systems’ compliant pins enhance overall flexibility by allowing for double-sided PCB capability.

According to Adam Kemp, Delphi Connection Systems product manager, “Because compliant pins are solder-free and lead-free, they can help OEMs meet key environmental objectives.”

“In addition to productivity enhancements, compliant pin products may offer a much better value to our customers faced with increasing capital demands needed for compliance,” said Kemp. The elimination of the soldering process may help automakers’ efforts to conform to existing and impending regulations, specifically the imperatives to eliminate lead in products and manufacturing systems. Those regulations include the European Union’s RoHs, WEEE, and ELV initiatives, among others.

Delphi Connection Systems currently offers select integrated seal modules with both straight- and right-angle header configurations. Future developments include USCAR unsealed compliant pin headers that can serve as drop in replacements for existing soldered applications.

Typical applications for Delphi Connection Systems’ press-fit compliant pins technology include the automotive telematics, infotainment, powertrain, and body electronics markets. Specifically, the technology can be integrated into engine, transmission and airbag control modules, antilock brake systems, key fobs, and impact sensors, among others.

At Delphi, we help make cars safer, cleaner, more efficient, and fun to drive. For more information about Delphi Corporation (OTC: DPHIQ), visit

This press release, as well as other statements made by Delphi may contain forward-looking statements within the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995, that reflect, when made, the company’s current views with respect to current events and financial performance. Such forward-looking statements are and will be, as the case may be, subject to many risks, uncertainties and factors relating to the company’s operations and business environment which may cause the actual results of the company to be materially different from any future results, express or implied, by such forward-looking statements. Factors that could cause actual results to differ materially from these forward-looking statements include, but are not limited to, the following: the ability of the company to continue as a going concern; the ability of the company to operate pursuant to the terms of the debtor-in-possession (“DIP”) financing facility; the company’s ability to obtain court approval with respect to motions in the chapter 11 proceeding prosecuted by it from time to time; the ability of the company to develop, prosecute, confirm and consummate one or more plans of reorganization with respect to the Chapter 11 cases; risks associated with third parties seeking and obtaining court approval to terminate or shorten the exclusivity period for the company to propose and confirm one or more plans of reorganization, for the appointment of a chapter 11 trustee or to convert the cases to chapter 7 cases; the ability of the company to obtain and maintain normal terms with vendors and service providers; the company’s ability to maintain contracts that are critical to its operations; the potential adverse impact of the Chapter 11 cases on the company’s liquidity or results of operations; the ability of the company to execute its business plans, including the transformation plan described in the Company’s March 31, 2006 press release, and to do so in a timely fashion; the ability of the company to attract, motivate and/or retain key executives and associates; the ability of the company to avoid or continue to operate during a strike, or partial work stoppage or slow down by any of its unionized employees; and the ability of the company to attract and retain customers. Other risk factors are listed from time to time in the company’s United States Securities and Exchange Commission reports, including, but not limited to the Annual Report on Form 10-K for the year ended December 31, 2004, and its most recent quarterly report on Form 10-Q for the quarter ended September 30, 2005, and current reports on Form 8-K. Delphi disclaims any intention or obligation to update or revise any forward-looking statements, whether as a result of new information, future events and/or otherwise.

Similarly, these and other factors, including the terms of any reorganization plan ultimately confirmed, can affect the value of the company’s various pre-petition liabilities, common stock and/or other equity securities. Additionally, no assurance can be given as to what values, if any, will be ascribed in the bankruptcy proceedings to each of these constituencies. A plan of reorganization could result in holders of Delphi’s common stock receiving no distribution on account of their interest and cancellation of their interests. Under certain conditions specified in the Bankruptcy Code, a plan of reorganization may be confirmed notwithstanding its rejection by an impaired class of creditors or equity holders and notwithstanding the fact that equity holders do not receive or retain property on account of their equity interests under the plan. In light of the foregoing and as stated in its October 8, 2005, press release announcing the filing of its Chapter 11 reorganization cases, the company considers the value of the common stock to be highly speculative and cautions equity holders that the stock may ultimately be determined to have no value. Accordingly, the company urges that appropriate caution be exercised with respect to existing and future investments in Delphi’s common stock or other equity interests or any claims relating to pre-petition liabilities.


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