Micron Introduces New NAND and Low-Power DRAM Multi-Chip Packages Built on the Industry’s Most Advanced Processes
Boise, Idaho - Micron Technology, Inc. today announced the company has combined the industry’s leading 34-nanometer (nm) 4Gb SLC NAND flash memory and 50nm 2Gb LPDDR to produce the most advanced NAND-LPDDR MCP combination in the market. Micron’s new 4Gb NAND-2Gb LPDDR MCP is targeted at smart phones, personal media players and emerging MIDs where small form factor, low-cost and power savings are critical features.
Micron is currently sampling the 4Gb NAND-2Gb LPDDR MCP with customers and expects to be in volume production in early 2010. The 4Gb NAND-2Gb LPDDR combination is targeted at mainstream densities in today’s mobile devices, but Micron has the flexibility to support higher densities – up to 8Gb NAND and 8Gb LPDDR – as the mobile market integrates sophisticated multimedia functionality. Visit the Micron Innovations blog to learn more about Micron’s new MCP products and read an insider’s perspective on the shifting mobile memory landscape.
“With Micron’s 34nm 4Gb NAND and 50nm 2Gb LPDDR monolithic die used in this package, we are providing customers with the most advanced solution available in NAND-based MCPs,” said Eric Spanneut, director of mobile memory marketing. “By combining the industry’s leading NAND and DRAM processes within our new generation of MCPs, we are able to easily accommodate the shift to high-density NAND devices as the industry progresses toward multi-function mobile devices.”
In addition to its MCP portfolio, Micron also offers a host of memory products for the mobile market, including discrete NAND and LPDRAM parts, e∙MMC 4.4 managed NAND solutions and NANDcode software. By working closely with the entire mobile value chain, including operating system and chipset vendors, Micron is in a unique position to offer customers a rich portfolio of engineering support and solutions for their respective design needs.
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Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron’s common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
This press release contains forward-looking statements regarding the production of Micron’s new MCP portfolio. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron’s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.
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